Abstract
A new metal structure consisting of AuZnNi/Ti/Au has been proposed for forming low-resistance ohmic contacts to p-GaAs with a fine-pattern definition. The dependency of the contact resistance on the Ti-layer thickness indicated that an optimum amount of Ti is requred for reducing the contact resistance. A minimun contact resistance (0.3 12-mm) was obtained with 150-nm thick Ti attached to Be-implanted p-GaAs at a dose of 6X 1013 cm-3.
Original language | English |
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Pages (from-to) | 1268-1269 |
Number of pages | 2 |
Journal | Japanese Journal of Applied Physics |
Volume | 25 |
Issue number | 8 |
DOIs |
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Publication status | Published - 1986 Aug |
Externally published | Yes |
ASJC Scopus subject areas
- Engineering(all)
- Physics and Astronomy(all)