TY - GEN
T1 - Measurement and analysis of SSN and Jitter of FPGA
AU - Fujita, Haruya
AU - Iijima, Yo
AU - Sudo, Toshio
PY - 2012/12/1
Y1 - 2012/12/1
N2 - Parasitic inductance that exists in a package induces SSN (Simultaneous Switching Noise) and timing jitter. These noises cause malfunction of LSI and systems. The goal of this paper is to clarify the influence of the effective inductance of the package including mutual inductance by changing the number of simultaneously switching buffers and alternating adjacent buffers in the reverse direction each other. In this study, measured SSNs were reproduced by HSPICE simulation. The whole simulation model consisted of on-chip PDN (Power Distribution Network), package PDN and board PDN, along with I/O buffer model. The simulated SSN waveforms agreed well with the measured results.
AB - Parasitic inductance that exists in a package induces SSN (Simultaneous Switching Noise) and timing jitter. These noises cause malfunction of LSI and systems. The goal of this paper is to clarify the influence of the effective inductance of the package including mutual inductance by changing the number of simultaneously switching buffers and alternating adjacent buffers in the reverse direction each other. In this study, measured SSNs were reproduced by HSPICE simulation. The whole simulation model consisted of on-chip PDN (Power Distribution Network), package PDN and board PDN, along with I/O buffer model. The simulated SSN waveforms agreed well with the measured results.
UR - http://www.scopus.com/inward/record.url?scp=84872516178&partnerID=8YFLogxK
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U2 - 10.1109/EMCEurope.2012.6396872
DO - 10.1109/EMCEurope.2012.6396872
M3 - Conference contribution
AN - SCOPUS:84872516178
SN - 9781467307185
T3 - IEEE International Symposium on Electromagnetic Compatibility
BT - EMC EUROPE 2012 - International Symposium on Electromagnetic Compatibility, Proceedings
T2 - International Symposium on Electromagnetic Compatibility, EMC EUROPE 2012
Y2 - 17 September 2012 through 21 September 2012
ER -