Mechanical Reliability of Solders in Small Volume

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	138-142
Number of pages	5
Journal	Journal of Japan Institute of Electronics Packaging
Volume	9
Issue number	3
DOIs	https://doi.org/10.5104/jiep.9.138
Publication status	Published - 2006

ASJC Scopus subject areas

@article{eef53092bb2146c19fac394a64243c9b,

title = "Mechanical Reliability of Solders in Small Volume",

author = "Yoshiharu Kariya",

year = "2006",

doi = "10.5104/jiep.9.138",

language = "English",

volume = "9",

pages = "138--142",

journal = "Journal of Japan Institute of Electronics Packaging",

issn = "1343-9677",

publisher = "The Japan Institute of Electronics Packaging",

number = "3",

}

TY - JOUR

T1 - Mechanical Reliability of Solders in Small Volume

AU - Kariya, Yoshiharu

PY - 2006

Y1 - 2006

UR - http://www.scopus.com/inward/record.url?scp=84903730823&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84903730823&partnerID=8YFLogxK

U2 - 10.5104/jiep.9.138

DO - 10.5104/jiep.9.138

M3 - Article

AN - SCOPUS:84903730823

SN - 1343-9677

VL - 9

SP - 138

EP - 142

JO - Journal of Japan Institute of Electronics Packaging

JF - Journal of Japan Institute of Electronics Packaging

IS - 3

ER -