Abstract
High-speed holographic microscopy is applied to take three successive photographs of rapidly bifurcating cracks. A crack propagates in a PMMA specimen at a speed more than 600 m/s, and bifurcates into two cracks in the observation area at the center of the specimen. The position at which the crack bifurcates is controlled by varying the tensile stress applied to the specimen. When it bifurcates, the fast propagating crack is recorded as three holograms. The holograms reconstruct the real images of the crack, which are photographed through a conventional microscope. From the photographs, crack speed before and after bifurcation is obtained. Crack speed after bifurcation is slightly lower than that before bifurcation. Crack opening displacement (COD) is also measured along a crack both before and after bifurcation. The COD before bifurcation is proportional to square root of the distance from the crack tip. After bifurcation, the COD of a mother crack is proportional to square root of the distance from the nominal tip of the mother crack. However, the CODs of two branch cracks are not always proportional to square root of the distance from each of the crack tips.
| Original language | English |
|---|---|
| Pages (from-to) | 480-487 |
| Number of pages | 8 |
| Journal | Proceedings of SPIE - The International Society for Optical Engineering |
| Volume | 4183 |
| Issue number | 1 |
| DOIs | |
| Publication status | Published - 2001 Apr 17 |
| Externally published | Yes |
Keywords
- Crack bifurcation
- Fast propagating crack
- Fracture mechanics
- High-speed photography
- Holography
- Microscopy
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Computer Science Applications
- Applied Mathematics
- Electrical and Electronic Engineering