| Original language | English |
|---|---|
| Journal | Default journal |
| Publication status | Published - 1998 Apr 1 |
Microstructure and Isothermal Fatigue Characteristics of Sn-Ag-X(X=Bi,Cu,Zn) Solder Alloys and Solder/Copper Joint
Yoshiharu Kariya, Yasuo Oguchi, Masahisa Otsuka
Research output: Contribution to journal › Article › peer-review