Microstructure and texture of electroplated copper in damascene structures

M. E. Gross, C. Lingk, T. Siegrist, E. Coleman, W. L. Brown, K. Ueno, Y. Tsuchiya, N. Itoh, T. Ritzdorf, J. Turner, K. Gibbons, E. Klawuhn, M. Biberger, W. Y.C. Lai, J. F. Miner, al et al

Research output: Contribution to journalConference articlepeer-review

22 Citations (Scopus)


The transition from Al to Cu for advanced ULSI interconnects involves changes in architecture and deposition technique that will influence the microstructure and texture of the metal. Cu interconnects are typically formed within the confines of pre-patterned trenches and vias using an electroplating process with a sputtered Cu conduction layer deposited over a refractory metal-based diffusion barrier layer. In this paper, we focus on the influence of the barrier layer (PVD Ti/TiN, Ta, TaN, CVD TiN) and the effect of a vacuum break between barrier and conduction layer depositions, on the texture of the Cu lines, as examined by X-ray diffraction pole figure analysis. A preferred (111) orientation was observed for all samples. The samples with no vacuum break between barrier and conduction layer deposition exhibited in plane anisotropy that was particularly pronounced for the Ta and TaN samples compared with the Ti/TiN sample. Focused ion beam images and transmission electron micrographs showed Cu grain size to be on the order of the trench width with a high degree of twinning, and no boundary could be distinguished between the PVD Cu conduction layer and the electroplated Cu.

Original languageEnglish
Pages (from-to)293-298
Number of pages6
JournalMaterials Research Society Symposium - Proceedings
Publication statusPublished - 1998
Externally publishedYes
EventProceedings of the 1998 MRS Spring Symposium - San Francisco, CA, USA
Duration: 1998 Apr 131998 Apr 15

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering


Dive into the research topics of 'Microstructure and texture of electroplated copper in damascene structures'. Together they form a unique fingerprint.

Cite this