Millimeter-wave three-dimensional masterslice MMICs

Kenjiro Nishikawa, Kenji Kamogawa, Koh Inoue, Kiyomitsu Onodera, Makoto Hirano, Tsuneo Tokumitsu, Ichihiko Toyoda

Research output: Chapter in Book/Report/Conference proceedingConference contribution


The three-dimensional (3D) masterslice MMIC technology has, even in the millimeter-wave region, the advantages of high integration levels, simple design procedures, short turn-around-time, and low fabrication cost. Fabricated V-band amplifiers achieve an 8-dB gain and a 5.3 dB noise figure in an area of 0.27 mm2. A U-band single-chip downconverter is also demonstrated.

Original languageEnglish
Title of host publicationIEEE Radio Frequency Integrated Circuits Symposium, RFIC, Digest of Technical Papers
Place of PublicationPiscataway, NJ, United States
Number of pages4
Publication statusPublished - 1998
Externally publishedYes
EventProceedings of the 1998 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium - Baltimore, MD, USA
Duration: 1998 Jun 71998 Jun 11


OtherProceedings of the 1998 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium
CityBaltimore, MD, USA

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Media Technology


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