Abstract
The three-dimensional (3D) masterslice MMIC technology has, even in the millimeter-wave region, the advantages of high integration levels, simple design procedures, short turn-around-time, and low fabrication cost. Fabricated V-band amplifiers achieve an 8-dB gain and a 5.3 dB noise figure in an area of 0.27 mm2. A U-band single-chip downconverter is also demonstrated.
Original language | English |
---|---|
Title of host publication | IEEE Radio Frequency Integrated Circuits Symposium, RFIC, Digest of Technical Papers |
Place of Publication | Piscataway, NJ, United States |
Publisher | IEEE |
Pages | 239-242 |
Number of pages | 4 |
Publication status | Published - 1998 |
Externally published | Yes |
Event | Proceedings of the 1998 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium - Baltimore, MD, USA Duration: 1998 Jun 7 → 1998 Jun 11 |
Other
Other | Proceedings of the 1998 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium |
---|---|
City | Baltimore, MD, USA |
Period | 98/6/7 → 98/6/11 |
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Media Technology