Original language | English |
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Journal | VLSI Packaging Workshop Japan |
Publication status | Published - 1992 Dec 1 |
Minimization of Effective Inductance of Ground Plane and Experimental Simultaneous Switching Noise in a Multilayer VLSI Package,
Y.Hiruta Y.Hiruta, N.Hirano N.Hirano, T.Sudo T.Sudo, Toshio Sudo
Research output: Contribution to journal › Article › peer-review