New two-step metal-CMP technique for a high performance multilevel interconnects featured by Al- and 'Cu in low ε, organic film'-metallizations

Y. Hayashi, T. Onodera, T. Nakajima, K. Kikuta, Y. Tsuchiya, J. Kawahara, S. Takahashi, K. Ueno, S. Chikaki

Research output: Contribution to journal › Conference article › peer-review

10 Citations (Scopus)

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Engineering & Materials Science