Nonlinear Mechanical Properties of Solder Alloys and Reliability Design for Thermal Fatigue

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	150-155
Number of pages	6
Journal	Journal of Japan Institute of Electronics Packaging
Volume	8
Issue number	2
DOIs	https://doi.org/10.5104/jiep.8.150
Publication status	Published - 2005
Externally published	Yes

ASJC Scopus subject areas

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title = "Nonlinear Mechanical Properties of Solder Alloys and Reliability Design for Thermal Fatigue",

author = "Yoshiharu Kariya and Minoru Mukai",

year = "2005",

doi = "10.5104/jiep.8.150",

language = "English",

volume = "8",

pages = "150--155",

journal = "Journal of Japan Institute of Electronics Packaging",

issn = "1343-9677",

publisher = "The Japan Institute of Electronics Packaging",

number = "2",

}

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AU - Kariya, Yoshiharu

AU - Mukai, Minoru

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JO - Journal of Japan Institute of Electronics Packaging

JF - Journal of Japan Institute of Electronics Packaging

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