Novel fabrication technology for ultra-compact three-dimensional MMICs

Suehiro Sugitani, Kiyomitsu Onodera, Shinji Aoyama, Makoto Hirano, Kimiyoshi Yamasaki

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

A novel interconnection technology has been developed for ultra-compact three-dimensional (3D) MMICs. A sophisticated 3D interconnection structure has been successfully fabricated using inductively-coupled-plasma etching with a doublelayer mask. This technology enables us to realize an ultra-compact MMICs.

Original languageEnglish
Title of host publicationEuropean Solid-State Device Research Conference
EditorsH. Grunbacher
PublisherIEEE Computer Society
Pages280-283
Number of pages4
ISBN (Electronic)2863322214
DOIs
Publication statusPublished - 1997
Externally publishedYes
Event27th European Solid-State Device Research Conference, ESSDERC 1997 - Stuttgart, Germany
Duration: 1997 Sept 221997 Sept 24

Publication series

NameEuropean Solid-State Device Research Conference
ISSN (Print)1930-8876

Conference

Conference27th European Solid-State Device Research Conference, ESSDERC 1997
Country/TerritoryGermany
CityStuttgart
Period97/9/2297/9/24

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality

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