Novel structure to realize crack-free plastic package during reflow soldering process - development of CSS (chip side support) package -

Tsutomu Nakazawa; Yumi Inoue; Kanako Sawada; Toshio Sudo

Novel structure to realize crack-free plastic package during reflow soldering process - development of CSS (chip side support) package -

Tsutomu Nakazawa, Yumi Inoue, Kanako Sawada, Toshio Sudo

Electrical Engineering and Computer Science

Research output: Contribution to conference › Paper › peer-review

Abstract

This paper reports a novel structure of a plastic package without a die-pad, whereby adhesion strength is improved and thermal stress reduced. The non-die-pad structure has been realized by the chip side support method. Further, the derivation of an equation that can be used as a criterion for judging package cracking or delamination is described by comparing the shear strength with the shear stress. The equation for shear stress can be estimated by the finite element method.

Original language	English
Pages	310-317
Number of pages	8
Publication status	Published - 1995 Dec 1
Event	Proceedings of the 17th IEEE/CPMT International Electronics Manufacturing Technology Symposium - Austin, TX, USA Duration: 1995 Oct 2 → 1995 Oct 4

Other

Other	Proceedings of the 17th IEEE/CPMT International Electronics Manufacturing Technology Symposium
City	Austin, TX, USA
Period	95/10/2 → 95/10/4

ASJC Scopus subject areas

Industrial and Manufacturing Engineering
Electrical and Electronic Engineering

Cite this

Novel structure to realize crack-free plastic package during reflow soldering process - development of CSS (chip side support) package -. / Nakazawa, Tsutomu; Inoue, Yumi; Sawada, Kanako et al.
1995. 310-317 Paper presented at Proceedings of the 17th IEEE/CPMT International Electronics Manufacturing Technology Symposium, Austin, TX, USA.

Research output: Contribution to conference › Paper › peer-review

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title = "Novel structure to realize crack-free plastic package during reflow soldering process - development of CSS (chip side support) package -",

abstract = "This paper reports a novel structure of a plastic package without a die-pad, whereby adhesion strength is improved and thermal stress reduced. The non-die-pad structure has been realized by the chip side support method. Further, the derivation of an equation that can be used as a criterion for judging package cracking or delamination is described by comparing the shear strength with the shear stress. The equation for shear stress can be estimated by the finite element method.",

author = "Tsutomu Nakazawa and Yumi Inoue and Kanako Sawada and Toshio Sudo",

year = "1995",

month = dec,

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pages = "310--317",

note = "Proceedings of the 17th IEEE/CPMT International Electronics Manufacturing Technology Symposium ; Conference date: 02-10-1995 Through 04-10-1995",

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AU - Nakazawa, Tsutomu

AU - Inoue, Yumi

AU - Sawada, Kanako

AU - Sudo, Toshio

PY - 1995/12/1

Y1 - 1995/12/1

N2 - This paper reports a novel structure of a plastic package without a die-pad, whereby adhesion strength is improved and thermal stress reduced. The non-die-pad structure has been realized by the chip side support method. Further, the derivation of an equation that can be used as a criterion for judging package cracking or delamination is described by comparing the shear strength with the shear stress. The equation for shear stress can be estimated by the finite element method.

AB - This paper reports a novel structure of a plastic package without a die-pad, whereby adhesion strength is improved and thermal stress reduced. The non-die-pad structure has been realized by the chip side support method. Further, the derivation of an equation that can be used as a criterion for judging package cracking or delamination is described by comparing the shear strength with the shear stress. The equation for shear stress can be estimated by the finite element method.

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M3 - Paper

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T2 - Proceedings of the 17th IEEE/CPMT International Electronics Manufacturing Technology Symposium

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ER -

Novel structure to realize crack-free plastic package during reflow soldering process - development of CSS (chip side support) package -

Abstract

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ASJC Scopus subject areas

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