Numerical simulation of gold nanoparticles dynamics in dielectrophoretic assembly

Ryosuke Nakagawara, Satoshi Uchida, Taiichi Shibuya, Hiroyuki Nishikawa

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)


The functional granular devices assembled by dielectrophoresis are expected to be using as high performance sensors. For the optimum fabrication of these devices, it is necessary to understand the behavior of nanoparticles in dielectrophoretic assembly. In this study, we evaluated the validity of the present analytical model, and investigated the influence of various setting parameters on particle coagulation. Many particles adhered to the edge of pit due to the formation of strong electric field. The transport and aggregation properties of Au nanoparticles were obtained theoretically and quantitatively. These analytical results qualitatively agreed with our experimental ones.

Original languageEnglish
Pages (from-to)107-114
Number of pages8
JournalIEEJ Transactions on Sensors and Micromachines
Issue number4
Publication statusPublished - 2017


  • Cellular automata
  • Dielectrophoresis
  • Gold nanoparticle
  • Numerical simulation
  • Particle behavior

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering


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