TY - GEN
T1 - On-board snubber circuit for damping of anti-resonance peak in total PDN
AU - Yamaguchi, Toma
AU - Kurita, Kanae
AU - Sudo, Toshio
PY - 2014/1/13
Y1 - 2014/1/13
N2 - Power supply noise is a serious issue for advanced CMOS LSIs and systems, since the performance of LSI chip is becoming more sensitive to power supply fluctuation under the lower power supply voltage. Because power supply noises are strongly related to the anti-resonance peak frequency in the total power distribution network (PDN), suppressing the anti-resonance peak is one of the most important design concerns. In this paper, the on-board snubber circuits (RC series circuits) has been studied to suppress the anti-resonance peak. The optimal circuit parameters of the on-board snubber circuits such as capacitance (Csnb) and resistance (Rdmp) were derived for quad flat package (QFP) and ball grid array (BGA) to effectively suppress the anti-resonance peak of the total PDN impedance. As a result, the settling time of power supply noises were greatly decreased. Furthermore, clock frequency dependency of power supply noise was also significantly decreased.
AB - Power supply noise is a serious issue for advanced CMOS LSIs and systems, since the performance of LSI chip is becoming more sensitive to power supply fluctuation under the lower power supply voltage. Because power supply noises are strongly related to the anti-resonance peak frequency in the total power distribution network (PDN), suppressing the anti-resonance peak is one of the most important design concerns. In this paper, the on-board snubber circuits (RC series circuits) has been studied to suppress the anti-resonance peak. The optimal circuit parameters of the on-board snubber circuits such as capacitance (Csnb) and resistance (Rdmp) were derived for quad flat package (QFP) and ball grid array (BGA) to effectively suppress the anti-resonance peak of the total PDN impedance. As a result, the settling time of power supply noises were greatly decreased. Furthermore, clock frequency dependency of power supply noise was also significantly decreased.
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U2 - 10.1109/ICSJ.2014.7009617
DO - 10.1109/ICSJ.2014.7009617
M3 - Conference contribution
AN - SCOPUS:84922768187
T3 - IEEE CPMT Symposium Japan 2014 - The Leading International Components, Packaging, and Manufacturing Technology Symposium: "Packaging for Future Optoelectronics, RF/High-Speed Electronics and Bioelectronics", ICSJ 2014
SP - 91
EP - 94
BT - IEEE CPMT Symposium Japan 2014 - The Leading International Components, Packaging, and Manufacturing Technology Symposium
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2014 4th IEEE CPMT Symposium Japan, ICSJ 2014
Y2 - 4 November 2014 through 6 November 2014
ER -