Optical isolator with Si guiding layer fabricated by photosensitive adhesive bonding

H. Yokoi, S. Choowitsakunlert, K. Kobayashi, K. Takagiwa

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

An optical isolator employing a nonreciprocal guided-radiation mode conversion is described. The optical isolator composes of a magneto-optic waveguide with a Si guiding layer, which can be realized by photosensitive adhesive bonding. The optical isolator was designed at a wavelength of 1.55 μm. Relationship of waveguide parameters was clarified for isolator operation. Dependence of the thickness of an adhesive layer was investigated for the design of the optical isolator.

Original languageEnglish
Title of host publicationSemiconductor Wafer Bonding
Subtitle of host publicationScience, Technology and Applications 14
EditorsT. Suga, H. Baumgart, F. Fournel, M. S. Goorsky, K. D. Hobart, R. Knechtel, C. S. Tan
PublisherElectrochemical Society Inc.
Pages215-220
Number of pages6
Edition9
ISBN (Electronic)9781607687269, 9781607687672, 9781607687689, 9781607687696, 9781607687702, 9781607687719, 9781607687726, 9781607687733, 9781607687740, 9781607687757, 9781607687771, 9781607687788, 9781607687795, 9781607687801, 9781607687818, 9781607687825, 9781607687832, 9781607687849, 9781607687856, 9781607687863, 9781607687887, 9781607687894, 9781607687900, 9781607687917, 9781607687924, 9781607687931, 9781607687948, 9781607687955, 9781607687962, 9781607687979, 9781607687986, 9781607687993, 9781607688006, 9781607688013, 9781607688020, 9781607688037
DOIs
Publication statusPublished - 2016
EventSymposium on Semiconductor Wafer Bonding: Science, Technology and Applications 14 - PRiME 2016/230th ECS Meeting - Honolulu, United States
Duration: 2016 Oct 22016 Oct 7

Publication series

NameECS Transactions
Number9
Volume75
ISSN (Print)1938-6737
ISSN (Electronic)1938-5862

Other

OtherSymposium on Semiconductor Wafer Bonding: Science, Technology and Applications 14 - PRiME 2016/230th ECS Meeting
Country/TerritoryUnited States
CityHonolulu
Period16/10/216/10/7

ASJC Scopus subject areas

  • General Engineering

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