Optimization of the diffusion joint process for the Ag layers of YBCO coated conductors

J. Kato, N. Sakai, S. Miyata, M. Konishi, Y. Yamada, N. Chikumoto, K. Nakao, T. Izumi, Y. Shiohara

Research output: Contribution to journalArticlepeer-review

31 Citations (Scopus)


Diffusion joint processes using Ag stabilizing layer for YBCO tape were performed in varied parameter such as temperature, time duration, cooling procedure and conditions of surface for Ag stabilizing layer to optimize for joint condition. We succeeded in developing a brief process with which low resistance below 5 × 10-13 Ω m2 at the joint without any degradation of Ic was achieved by polishing surface of Ag stabilizing layer and quenching procedure. The polishing is effective in reducing joint time and temperature. The mechanism was discussed for the decrease in Ic after joint held at 873 K.

Original languageEnglish
Pages (from-to)747-750
Number of pages4
JournalPhysica C: Superconductivity and its applications
Issue numberSUPPL.
Publication statusPublished - 2007 Oct 1
Externally publishedYes


  • Ag
  • Coated conductor
  • Diffusion joint
  • YBCO

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Energy Engineering and Power Technology
  • Electrical and Electronic Engineering


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