Optimization of the diffusion joint process for the Ag layers of YBCO coated conductors

J. Kato; N. Sakai; S. Miyata; M. Konishi; Y. Yamada; N. Chikumoto; K. Nakao; T. Izumi; Y. Shiohara

doi:10.1016/j.physc.2007.02.058

Optimization of the diffusion joint process for the Ag layers of YBCO coated conductors

J. Kato, N. Sakai, S. Miyata, M. Konishi, Y. Yamada, N. Chikumoto, K. Nakao, T. Izumi, Y. Shiohara

Research output: Contribution to journal › Article › peer-review

31 Citations (Scopus)

Abstract

Diffusion joint processes using Ag stabilizing layer for YBCO tape were performed in varied parameter such as temperature, time duration, cooling procedure and conditions of surface for Ag stabilizing layer to optimize for joint condition. We succeeded in developing a brief process with which low resistance below 5 × 10^-13 Ω m² at the joint without any degradation of I_c was achieved by polishing surface of Ag stabilizing layer and quenching procedure. The polishing is effective in reducing joint time and temperature. The mechanism was discussed for the decrease in I_c after joint held at 873 K.

Original language	English
Pages (from-to)	747-750
Number of pages	4
Journal	Physica C: Superconductivity and its applications
Volume	463-465
Issue number	SUPPL.
DOIs	https://doi.org/10.1016/j.physc.2007.02.058
Publication status	Published - 2007 Oct 1
Externally published	Yes

Keywords

Ag
Coated conductor
Diffusion joint
YBCO

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Energy Engineering and Power Technology
Electrical and Electronic Engineering

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10.1016/j.physc.2007.02.058

Cite this

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title = "Optimization of the diffusion joint process for the Ag layers of YBCO coated conductors",

abstract = "Diffusion joint processes using Ag stabilizing layer for YBCO tape were performed in varied parameter such as temperature, time duration, cooling procedure and conditions of surface for Ag stabilizing layer to optimize for joint condition. We succeeded in developing a brief process with which low resistance below 5 × 10-13 Ω m2 at the joint without any degradation of Ic was achieved by polishing surface of Ag stabilizing layer and quenching procedure. The polishing is effective in reducing joint time and temperature. The mechanism was discussed for the decrease in Ic after joint held at 873 K.",

keywords = "Ag, Coated conductor, Diffusion joint, YBCO",

author = "J. Kato and N. Sakai and S. Miyata and M. Konishi and Y. Yamada and N. Chikumoto and K. Nakao and T. Izumi and Y. Shiohara",

note = "Funding Information: This work was supported by the New Energy and Industrial Technology Development Organization (NEDO) as the Collaborative Research and Development of Fundamental Technologies for Superconductivity Applications. Copyright: Copyright 2008 Elsevier B.V., All rights reserved.",

year = "2007",

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doi = "10.1016/j.physc.2007.02.058",

language = "English",

volume = "463-465",

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journal = "Physica C: Superconductivity and its applications",

issn = "0921-4534",

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T1 - Optimization of the diffusion joint process for the Ag layers of YBCO coated conductors

AU - Kato, J.

AU - Sakai, N.

AU - Miyata, S.

AU - Konishi, M.

AU - Yamada, Y.

AU - Chikumoto, N.

AU - Nakao, K.

AU - Izumi, T.

AU - Shiohara, Y.

N1 - Funding Information: This work was supported by the New Energy and Industrial Technology Development Organization (NEDO) as the Collaborative Research and Development of Fundamental Technologies for Superconductivity Applications. Copyright: Copyright 2008 Elsevier B.V., All rights reserved.

PY - 2007/10/1

Y1 - 2007/10/1

N2 - Diffusion joint processes using Ag stabilizing layer for YBCO tape were performed in varied parameter such as temperature, time duration, cooling procedure and conditions of surface for Ag stabilizing layer to optimize for joint condition. We succeeded in developing a brief process with which low resistance below 5 × 10-13 Ω m2 at the joint without any degradation of Ic was achieved by polishing surface of Ag stabilizing layer and quenching procedure. The polishing is effective in reducing joint time and temperature. The mechanism was discussed for the decrease in Ic after joint held at 873 K.

AB - Diffusion joint processes using Ag stabilizing layer for YBCO tape were performed in varied parameter such as temperature, time duration, cooling procedure and conditions of surface for Ag stabilizing layer to optimize for joint condition. We succeeded in developing a brief process with which low resistance below 5 × 10-13 Ω m2 at the joint without any degradation of Ic was achieved by polishing surface of Ag stabilizing layer and quenching procedure. The polishing is effective in reducing joint time and temperature. The mechanism was discussed for the decrease in Ic after joint held at 873 K.

KW - Ag

KW - Coated conductor

KW - Diffusion joint

KW - YBCO

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M3 - Article

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VL - 463-465

SP - 747

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JO - Physica C: Superconductivity and its applications

JF - Physica C: Superconductivity and its applications

IS - SUPPL.

ER -

Optimization of the diffusion joint process for the Ag layers of YBCO coated conductors

Abstract

Keywords

ASJC Scopus subject areas

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