Partly-additive process for manufacturing high-density printed wiring boards

Shinichiro Imabayashi; Isamu Tanaka; Hiroshi Kikuchi; Makio Watanabe; Hitoshi Oka; Shusaku Izumi; Yukihiro Taniguchi; Shigeru Fujita

Partly-additive process for manufacturing high-density printed wiring boards

Shinichiro Imabayashi, Isamu Tanaka, Hiroshi Kikuchi, Makio Watanabe, Hitoshi Oka, Shusaku Izumi, Yukihiro Taniguchi, Shigeru Fujita

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Citations (Scopus)

Abstract

A highly reliable, high-density printed wiring board process called the partly additive process has been developed for manufacturing high-speed digital switching systems. The partly additive process realizes very fine, highly reliable through-holes and circuit patterns at fairly low cost. To realize this process, a specially designed solder-resist that can withstand high temperatures and the high alkalinity of electroless copper plating solution was developed. A new electroless copper plating solution was also developed that can deposite copper having excellent mechanical and electrical properties. The composition of the electroless copper plating solution could be tightly controlled using a newly developed system to automatically monitor and supply solution components accurately.

Original language	English
Title of host publication	Proceedings - Electronic Components Conference
Publisher	Publ by IEEE
Pages	1053-1059
Number of pages	7
ISBN (Print)	0818626607
Publication status	Published - 1992 Jan 1
Externally published	Yes
Event	Proceedings of the 42nd Electronic Components and Technology Conference - San Diego, CA, USA Duration: 1992 May 18 → 1992 May 20

Publication series

Name	Proceedings - Electronic Components Conference
ISSN (Print)	0569-5503

Other

Other	Proceedings of the 42nd Electronic Components and Technology Conference
City	San Diego, CA, USA
Period	92/5/18 → 92/5/20

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Cite this

Imabayashi, S, Tanaka, I, Kikuchi, H, Watanabe, M, Oka, H, Izumi, S, Taniguchi, Y & Fujita, S 1992, Partly-additive process for manufacturing high-density printed wiring boards. in Proceedings - Electronic Components Conference. Proceedings - Electronic Components Conference, Publ by IEEE, pp. 1053-1059, Proceedings of the 42nd Electronic Components and Technology Conference, San Diego, CA, USA, 92/5/18.

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AU - Imabayashi, Shinichiro

AU - Tanaka, Isamu

AU - Kikuchi, Hiroshi

AU - Watanabe, Makio

AU - Oka, Hitoshi

AU - Izumi, Shusaku

AU - Taniguchi, Yukihiro

AU - Fujita, Shigeru

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AB - A highly reliable, high-density printed wiring board process called the partly additive process has been developed for manufacturing high-speed digital switching systems. The partly additive process realizes very fine, highly reliable through-holes and circuit patterns at fairly low cost. To realize this process, a specially designed solder-resist that can withstand high temperatures and the high alkalinity of electroless copper plating solution was developed. A new electroless copper plating solution was also developed that can deposite copper having excellent mechanical and electrical properties. The composition of the electroless copper plating solution could be tightly controlled using a newly developed system to automatically monitor and supply solution components accurately.

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Partly-additive process for manufacturing high-density printed wiring boards

Abstract

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ASJC Scopus subject areas

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