Plasma printing of micro-punch assembly for micro-embossing of aluminum sheets

Tatsuhiko Aizawa, Kenji Wasa, Abdelrahman Farghali, Hiroshi Tamagaki

Research output: Chapter in Book/Report/Conference proceedingConference contribution


This paper concerned with micro-embossing of micro-cavities and micro-grooves into aluminum sheets by CNC-stamping with use of the arrayed DLC multi-punches. Both SKD11 and AISI420 steel die substrates were prepared and DLC-coated with the thickness of 10 to 15 μm. This DLC coating worked as a punch material. The two dimensional micro-patterns were printed onto this DLC film by maskless lithography. The unprinted DLC films were removed by the plasma oxidation to leave the three dimensional DLC-punch array on the steel substrate. This micro-pillared and micro-grooved DLC-punches were placed into the cassette die set for micro-embossing process by using the table-top CNC stamper. The micro-circular patterns transformed to the micro-pillars in the DLC punch by the plasma oxidation. Through the CNC-micro-embossing, this micro-texture further transferred to micro-cavities in the aluminum sheet. The dimensional accuracy of embossed micro-textures by stamping was measured by SEM and three dimensional profilometer with comparison to the tailored micro-pattern and the DLC-punch array configuration.

Original languageEnglish
Title of host publicationTechnology of Plasticity
EditorsGou-Jen Wang, Kuang-Jau Fann, Yeong-Maw Hwang, Cho-Pei Jiang
PublisherTrans Tech Publications Ltd
Number of pages6
ISBN (Print)9783035713039
Publication statusPublished - 2018
Event1st Asia Pacific Symposium on Technology of Plasticity, APSTP 2017 - Taichung, Taiwan, Province of China
Duration: 2017 Nov 222017 Nov 25

Publication series

NameMaterials Science Forum
Volume920 MSF
ISSN (Print)0255-5476
ISSN (Electronic)1662-9752


Other1st Asia Pacific Symposium on Technology of Plasticity, APSTP 2017
Country/TerritoryTaiwan, Province of China


  • Aluminum sheets
  • Heat transfer
  • Micro-cavity textures
  • Micro-embossing
  • Multi DLC-punch assembly
  • Plasma oxidation
  • Plasma printing

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering


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