TY - GEN
T1 - Plasma printing of micro-punch assembly for micro-embossing of aluminum sheets
AU - Aizawa, Tatsuhiko
AU - Wasa, Kenji
AU - Farghali, Abdelrahman
AU - Tamagaki, Hiroshi
N1 - Funding Information:
The authors would like to express their gratitude to Mr. Shimomura, Mr. S. Kurozumi (SIT) and Dr. K. Akari (Kobelco, Co. Ltd.) for their help in experiments. This study is financially supported in part by the MEXT-project.
Publisher Copyright:
© 2018 Trans Tech Publications, Switzerland.
PY - 2018
Y1 - 2018
N2 - This paper concerned with micro-embossing of micro-cavities and micro-grooves into aluminum sheets by CNC-stamping with use of the arrayed DLC multi-punches. Both SKD11 and AISI420 steel die substrates were prepared and DLC-coated with the thickness of 10 to 15 μm. This DLC coating worked as a punch material. The two dimensional micro-patterns were printed onto this DLC film by maskless lithography. The unprinted DLC films were removed by the plasma oxidation to leave the three dimensional DLC-punch array on the steel substrate. This micro-pillared and micro-grooved DLC-punches were placed into the cassette die set for micro-embossing process by using the table-top CNC stamper. The micro-circular patterns transformed to the micro-pillars in the DLC punch by the plasma oxidation. Through the CNC-micro-embossing, this micro-texture further transferred to micro-cavities in the aluminum sheet. The dimensional accuracy of embossed micro-textures by stamping was measured by SEM and three dimensional profilometer with comparison to the tailored micro-pattern and the DLC-punch array configuration.
AB - This paper concerned with micro-embossing of micro-cavities and micro-grooves into aluminum sheets by CNC-stamping with use of the arrayed DLC multi-punches. Both SKD11 and AISI420 steel die substrates were prepared and DLC-coated with the thickness of 10 to 15 μm. This DLC coating worked as a punch material. The two dimensional micro-patterns were printed onto this DLC film by maskless lithography. The unprinted DLC films were removed by the plasma oxidation to leave the three dimensional DLC-punch array on the steel substrate. This micro-pillared and micro-grooved DLC-punches were placed into the cassette die set for micro-embossing process by using the table-top CNC stamper. The micro-circular patterns transformed to the micro-pillars in the DLC punch by the plasma oxidation. Through the CNC-micro-embossing, this micro-texture further transferred to micro-cavities in the aluminum sheet. The dimensional accuracy of embossed micro-textures by stamping was measured by SEM and three dimensional profilometer with comparison to the tailored micro-pattern and the DLC-punch array configuration.
KW - Aluminum sheets
KW - Heat transfer
KW - Micro-cavity textures
KW - Micro-embossing
KW - Multi DLC-punch assembly
KW - Plasma oxidation
KW - Plasma printing
UR - http://www.scopus.com/inward/record.url?scp=85046380022&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85046380022&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/MSF.920.161
DO - 10.4028/www.scientific.net/MSF.920.161
M3 - Conference contribution
AN - SCOPUS:85046380022
SN - 9783035713039
T3 - Materials Science Forum
SP - 161
EP - 166
BT - Technology of Plasticity
A2 - Wang, Gou-Jen
A2 - Fann, Kuang-Jau
A2 - Hwang, Yeong-Maw
A2 - Jiang, Cho-Pei
PB - Trans Tech Publications Ltd
T2 - 1st Asia Pacific Symposium on Technology of Plasticity, APSTP 2017
Y2 - 22 November 2017 through 25 November 2017
ER -