Abstract
Bismuth titanate (Bi4Ti3O12) thin films with a high c-axis orientation up to 99% were prepared on (100)-oriented silicon wafers by r.f. planar magnetron sputtering using a Bi2TiO5 ceramic target at a substrate temperature of 600°C. From the Auger electron spectroscopy depth profile of the film, there is no evidence of interdiffusion of a specific element between the film and the substrate. Relative dielectric constant of these films depends on film thickness. The behavior was explained assuming a low-dielectric-constant interface layer. Using this assumption, the relative dielectric constant of Bi4Ti3O12 film was estimated to be approximately 140. This value is close to that along the c axis in a bulk form. The remanent polarization and the coercive field were 0.8 μC cm-2 and 20 kV cm-1, respectively.
Original language | English |
---|---|
Pages (from-to) | 299-304 |
Number of pages | 6 |
Journal | Thin Solid Films |
Volume | 300 |
Issue number | 1-2 |
DOIs | |
Publication status | Published - 1997 May 28 |
Keywords
- Crystallization
- Dielectric properties
- Optical properties
- Sputtering
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Surfaces and Interfaces
- Surfaces, Coatings and Films
- Metals and Alloys
- Materials Chemistry