Reduction in Radiated Emission Using CSP with Built-in Decoupling Capacitor,

K.Nakano K.Nakano, T.Sudo T.Sudo, S.Haga S.Haga, Toshio Sudo

Research output: Contribution to journal › Article › peer-review

Original language	English
Journal	IEEE 12th Topical Meeting on Electrical Performance of Electronic Packaging
Publication status	Published - 2003 Oct 25

Cite this

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title = "Reduction in Radiated Emission Using CSP with Built-in Decoupling Capacitor,",

author = "K.Nakano K.Nakano and T.Sudo T.Sudo and S.Haga S.Haga and Toshio Sudo",

year = "2003",

month = oct,

day = "25",

language = "English",

journal = "IEEE 12th Topical Meeting on Electrical Performance of Electronic Packaging",

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TY - JOUR

T1 - Reduction in Radiated Emission Using CSP with Built-in Decoupling Capacitor,

AU - K.Nakano, K.Nakano

AU - T.Sudo, T.Sudo

AU - S.Haga, S.Haga

AU - Sudo, Toshio

PY - 2003/10/25

Y1 - 2003/10/25

M3 - Article

JO - IEEE 12th Topical Meeting on Electrical Performance of Electronic Packaging

JF - IEEE 12th Topical Meeting on Electrical Performance of Electronic Packaging

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