Reliability of Flip-chip Interconnection by Eutectic Solder Bumps

Y.Hiruta Y.Hiruta, K.Doi K.Doi, N.Hirano N.Hirano, T.Okada T.Okada, T.Sudo T.Sudo, Toshio Sudo

Research output: Contribution to journal › Article › peer-review

Original language	English
Journal	IEEE VLSI Packaging Workshop, Montrey
Publication status	Published - 1995 Oct 25

Cite this

@article{42b4a4baacf843f2850f535f644126ad,

title = "Reliability of Flip-chip Interconnection by Eutectic Solder Bumps",

author = "Y.Hiruta Y.Hiruta and K.Doi K.Doi and N.Hirano N.Hirano and T.Okada T.Okada and T.Sudo T.Sudo and Toshio Sudo",

year = "1995",

month = oct,

day = "25",

language = "English",

journal = "IEEE VLSI Packaging Workshop, Montrey",

}