Reproduction analysis of fatigue crack networks in Sn-Ag-Cu die attach joint by FEA

Hiroki Kanai; Yoshiharu Kariya; Yoshiki Abe; Yoshinori Yokoyama; Koki Ochi; Ryuichiro Hanada; Shinichi Izuo

doi:10.1109/LTB-3D53950.2021.9598392

Reproduction analysis of fatigue crack networks in Sn-Ag-Cu die attach joint by FEA

Hiroki Kanai, Yoshiharu Kariya, Yoshiki Abe, Yoshinori Yokoyama, Koki Ochi, Ryuichiro Hanada, Shinichi Izuo

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

The formation process of fatigue crack networks in SnAg-Cu die attach joint was experimentally observed, and reproduced by the Finite Element method Analysis (FEA) based on a crack initiation rule described by the logistic function and Paris type fatigue crack propagation law.

Original language	English
Title of host publication	2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	43
Number of pages	1
ISBN (Electronic)	9781665405676
DOIs	https://doi.org/10.1109/LTB-3D53950.2021.9598392
Publication status	Published - 2021 Oct 5
Event	7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021 - Virtual, Online, Japan Duration: 2021 Oct 5 → 2021 Oct 11

Publication series

Name	2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021

Conference

Conference	7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021
Country/Territory	Japan
City	Virtual, Online
Period	21/10/5 → 21/10/11

ASJC Scopus subject areas

Electrical and Electronic Engineering
Industrial and Manufacturing Engineering
Electronic, Optical and Magnetic Materials

Access to Document

10.1109/LTB-3D53950.2021.9598392

Cite this

Kanai, H., Kariya, Y., Abe, Y., Yokoyama, Y., Ochi, K., Hanada, R., & Izuo, S. (2021). Reproduction analysis of fatigue crack networks in Sn-Ag-Cu die attach joint by FEA. In 2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021 (pp. 43). (2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/LTB-3D53950.2021.9598392

Reproduction analysis of fatigue crack networks in Sn-Ag-Cu die attach joint by FEA. / Kanai, Hiroki; Kariya, Yoshiharu; Abe, Yoshiki et al.
2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021. Institute of Electrical and Electronics Engineers Inc., 2021. p. 43 (2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Kanai, H, Kariya, Y, Abe, Y, Yokoyama, Y, Ochi, K, Hanada, R & Izuo, S 2021, Reproduction analysis of fatigue crack networks in Sn-Ag-Cu die attach joint by FEA. in 2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021. 2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021, Institute of Electrical and Electronics Engineers Inc., pp. 43, 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021, Virtual, Online, Japan, 21/10/5. https://doi.org/10.1109/LTB-3D53950.2021.9598392

Kanai H, Kariya Y, Abe Y, Yokoyama Y, Ochi K, Hanada R et al. Reproduction analysis of fatigue crack networks in Sn-Ag-Cu die attach joint by FEA. In 2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021. Institute of Electrical and Electronics Engineers Inc. 2021. p. 43. (2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021). doi: 10.1109/LTB-3D53950.2021.9598392

Kanai, Hiroki ; Kariya, Yoshiharu ; Abe, Yoshiki et al. / Reproduction analysis of fatigue crack networks in Sn-Ag-Cu die attach joint by FEA. 2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021. Institute of Electrical and Electronics Engineers Inc., 2021. pp. 43 (2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021).

@inproceedings{fe745a4205d5445c91bc7a2e02786410,

title = "Reproduction analysis of fatigue crack networks in Sn-Ag-Cu die attach joint by FEA",

abstract = "The formation process of fatigue crack networks in SnAg-Cu die attach joint was experimentally observed, and reproduced by the Finite Element method Analysis (FEA) based on a crack initiation rule described by the logistic function and Paris type fatigue crack propagation law.",

author = "Hiroki Kanai and Yoshiharu Kariya and Yoshiki Abe and Yoshinori Yokoyama and Koki Ochi and Ryuichiro Hanada and Shinichi Izuo",

note = "Publisher Copyright: {\textcopyright} 2021 IEEE; 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021 ; Conference date: 05-10-2021 Through 11-10-2021",

year = "2021",

month = oct,

day = "5",

doi = "10.1109/LTB-3D53950.2021.9598392",

language = "English",

series = "2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "43",

booktitle = "2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021",

}

TY - GEN

T1 - Reproduction analysis of fatigue crack networks in Sn-Ag-Cu die attach joint by FEA

AU - Kanai, Hiroki

AU - Kariya, Yoshiharu

AU - Abe, Yoshiki

AU - Yokoyama, Yoshinori

AU - Ochi, Koki

AU - Hanada, Ryuichiro

AU - Izuo, Shinichi

PY - 2021/10/5

Y1 - 2021/10/5

N2 - The formation process of fatigue crack networks in SnAg-Cu die attach joint was experimentally observed, and reproduced by the Finite Element method Analysis (FEA) based on a crack initiation rule described by the logistic function and Paris type fatigue crack propagation law.

AB - The formation process of fatigue crack networks in SnAg-Cu die attach joint was experimentally observed, and reproduced by the Finite Element method Analysis (FEA) based on a crack initiation rule described by the logistic function and Paris type fatigue crack propagation law.

UR - http://www.scopus.com/inward/record.url?scp=85120423218&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85120423218&partnerID=8YFLogxK

U2 - 10.1109/LTB-3D53950.2021.9598392

DO - 10.1109/LTB-3D53950.2021.9598392

M3 - Conference contribution

AN - SCOPUS:85120423218

T3 - 2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021

SP - 43

BT - 2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021

Y2 - 5 October 2021 through 11 October 2021

ER -

Reproduction analysis of fatigue crack networks in Sn-Ag-Cu die attach joint by FEA

Abstract

Publication series

Conference

ASJC Scopus subject areas

Access to Document

Other files and links

Fingerprint

Cite this