TY - GEN
T1 - Signal transmission loss on printed circuit board in GHz frequency region
AU - Okubo, Takaaki
AU - Sudo, Toshio
AU - Hosoi, Toshihiro
AU - Tsuyoshi, Hiroaki
AU - Kuwako, Fujio
PY - 2013/12/1
Y1 - 2013/12/1
N2 - Higher-speed signal transmission is strongly required on a printed circuit board to handle massive data in electronic systems. So, signal transmission loss of copper wiring on a printed circuit board has been studied First, total signal loss was divided into dielectric loss and conductor loss quantitatively based on electromagnetic theory. In particular, the scattering loss due to surface roughness of copper foil has been examined in detail And the usefulness of the copper foil with low surface roughness has been demonstrated
AB - Higher-speed signal transmission is strongly required on a printed circuit board to handle massive data in electronic systems. So, signal transmission loss of copper wiring on a printed circuit board has been studied First, total signal loss was divided into dielectric loss and conductor loss quantitatively based on electromagnetic theory. In particular, the scattering loss due to surface roughness of copper foil has been examined in detail And the usefulness of the copper foil with low surface roughness has been demonstrated
KW - copper foil
KW - high-speed signal transmission
KW - signal loss
KW - surface roughness
UR - http://www.scopus.com/inward/record.url?scp=84894160896&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84894160896&partnerID=8YFLogxK
U2 - 10.1109/EDAPS.2013.6724402
DO - 10.1109/EDAPS.2013.6724402
M3 - Conference contribution
AN - SCOPUS:84894160896
SN - 9781479923113
T3 - EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium
SP - 112
EP - 115
BT - EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium
T2 - 2013 6th IEEE Electrical Design of Advanced Packaging Systems Symposium, EDAPS 2013
Y2 - 12 December 2013 through 15 December 2013
ER -