Simplified and practical estimation of package cracking during reflow soldering process

K. Sawada; T. Nakazawa; N. Kawamura; K. Matsumoto; Y. Hiruta; T. Sudo

doi:10.1109/relphy.1994.307848

Simplified and practical estimation of package cracking during reflow soldering process

K. Sawada, T. Nakazawa, N. Kawamura, K. Matsumoto, Y. Hiruta, T. Sudo

Electrical Engineering and Computer Science

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

17 Citations (Scopus)

Abstract

A simple method has been developed to estimate cracking of plastic packages during reflow soldering process. A criterion for estimating package cracking has been introduced by comparing the mold resin fracture toughness and the maximum value of the stress intensity factor in the package. The criterion equation for package cracking was made to an empirical form. The real-time measurement of package deformation is effective for providing information on the difference of the fracture mode. The difference of the delamination in the package causes the different shape of the deformation curve. The absorption characteristic of the package obeys Fick's law even for thinner packages.

Original language	English
Title of host publication	Annual Proceedings - Reliability Physics (Symposium)
Publisher	Publ by IEEE
Pages	114-119
Number of pages	6
ISBN (Print)	0780313577, 9780780313576
DOIs	https://doi.org/10.1109/relphy.1994.307848
Publication status	Published - 1994
Event	Proceedings of the 32nd Annual International Reliability Physics Proceedings - San Jose, CA, USA Duration: 1994 Apr 12 → 1994 Apr 14

Publication series

Name	Annual Proceedings - Reliability Physics (Symposium)
ISSN (Print)	0099-9512

Other

Other	Proceedings of the 32nd Annual International Reliability Physics Proceedings
City	San Jose, CA, USA
Period	94/4/12 → 94/4/14

ASJC Scopus subject areas

Electrical and Electronic Engineering
Safety, Risk, Reliability and Quality

Access to Document

10.1109/relphy.1994.307848

Cite this

Sawada, K, Nakazawa, T, Kawamura, N, Matsumoto, K, Hiruta, Y & Sudo, T 1994, Simplified and practical estimation of package cracking during reflow soldering process. in Annual Proceedings - Reliability Physics (Symposium). Annual Proceedings - Reliability Physics (Symposium), Publ by IEEE, pp. 114-119, Proceedings of the 32nd Annual International Reliability Physics Proceedings, San Jose, CA, USA, 94/4/12. https://doi.org/10.1109/relphy.1994.307848

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abstract = "A simple method has been developed to estimate cracking of plastic packages during reflow soldering process. A criterion for estimating package cracking has been introduced by comparing the mold resin fracture toughness and the maximum value of the stress intensity factor in the package. The criterion equation for package cracking was made to an empirical form. The real-time measurement of package deformation is effective for providing information on the difference of the fracture mode. The difference of the delamination in the package causes the different shape of the deformation curve. The absorption characteristic of the package obeys Fick's law even for thinner packages.",

author = "K. Sawada and T. Nakazawa and N. Kawamura and K. Matsumoto and Y. Hiruta and T. Sudo",

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AU - Sudo, T.

PY - 1994

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AB - A simple method has been developed to estimate cracking of plastic packages during reflow soldering process. A criterion for estimating package cracking has been introduced by comparing the mold resin fracture toughness and the maximum value of the stress intensity factor in the package. The criterion equation for package cracking was made to an empirical form. The real-time measurement of package deformation is effective for providing information on the difference of the fracture mode. The difference of the delamination in the package causes the different shape of the deformation curve. The absorption characteristic of the package obeys Fick's law even for thinner packages.

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M3 - Conference contribution

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BT - Annual Proceedings - Reliability Physics (Symposium)

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Simplified and practical estimation of package cracking during reflow soldering process

Abstract

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