| Original language | English |
|---|---|
| Pages (from-to) | 330-333 |
| Journal | IEMT Japan Symposium |
| Publication status | Published - 1991 May 25 |
Simulation of Coupling Effects Among Multiconductor Lines on a Thin Film Multichip Module,
J.Kudo J.Kudo, T.Sudo T.Sudo, Toshio Sudo
Research output: Contribution to journal › Article › peer-review