Single-sided Multi-layer Electric Circuit by Hot Stamping with 3D Printer

Yuhei Imai; Hiroyuki Manabe

doi:10.1145/3474349.3480200

Single-sided Multi-layer Electric Circuit by Hot Stamping with 3D Printer

Yuhei Imai, Hiroyuki Manabe

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

The spread of personal computer-Aided fabrication has made it possible for individuals to create things that meet their personal needs. However, it is still not easy for an individual to prototype electronic circuits. Several methods have been proposed for quickly prototyping electronic circuits. Our solution is combining a 3D printer with transfer foil. This paper expands our original circuit printing method so as to fabricate single-sided multi-layer boards. We show that the proposed technique allows a 3D printer and two types of transfer foil to create single-sided multi-layer circuits.

Original language	English
Title of host publication	Adjunct Publication of the 34th Annual ACM Symposium on User Interface Software and Technology, UIST 2021
Publisher	Association for Computing Machinery, Inc
Pages	126-128
Number of pages	3
ISBN (Electronic)	9781450386555
DOIs	https://doi.org/10.1145/3474349.3480200
Publication status	Published - 2021 Oct 10
Event	34th Annual ACM Symposium on User Interface Software and Technology, UIST 2021 - Virtual, Online, United States Duration: 2021 Oct 10 → 2021 Oct 14

Publication series

Name	Adjunct Publication of the 34th Annual ACM Symposium on User Interface Software and Technology, UIST 2021

Conference

Conference	34th Annual ACM Symposium on User Interface Software and Technology, UIST 2021
Country/Territory	United States
City	Virtual, Online
Period	21/10/10 → 21/10/14

Keywords

3D printer
hot stamping
Multi-layer electric circuit
silver paste
transfer foil

ASJC Scopus subject areas

Software
Human-Computer Interaction

Access to Document

10.1145/3474349.3480200

Cite this

Imai, Y., & Manabe, H. (2021). Single-sided Multi-layer Electric Circuit by Hot Stamping with 3D Printer. In Adjunct Publication of the 34th Annual ACM Symposium on User Interface Software and Technology, UIST 2021 (pp. 126-128). (Adjunct Publication of the 34th Annual ACM Symposium on User Interface Software and Technology, UIST 2021). Association for Computing Machinery, Inc. https://doi.org/10.1145/3474349.3480200

Single-sided Multi-layer Electric Circuit by Hot Stamping with 3D Printer. / Imai, Yuhei; Manabe, Hiroyuki.
Adjunct Publication of the 34th Annual ACM Symposium on User Interface Software and Technology, UIST 2021. Association for Computing Machinery, Inc, 2021. p. 126-128 (Adjunct Publication of the 34th Annual ACM Symposium on User Interface Software and Technology, UIST 2021).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Imai, Y & Manabe, H 2021, Single-sided Multi-layer Electric Circuit by Hot Stamping with 3D Printer. in Adjunct Publication of the 34th Annual ACM Symposium on User Interface Software and Technology, UIST 2021. Adjunct Publication of the 34th Annual ACM Symposium on User Interface Software and Technology, UIST 2021, Association for Computing Machinery, Inc, pp. 126-128, 34th Annual ACM Symposium on User Interface Software and Technology, UIST 2021, Virtual, Online, United States, 21/10/10. https://doi.org/10.1145/3474349.3480200

Imai Y, Manabe H. Single-sided Multi-layer Electric Circuit by Hot Stamping with 3D Printer. In Adjunct Publication of the 34th Annual ACM Symposium on User Interface Software and Technology, UIST 2021. Association for Computing Machinery, Inc. 2021. p. 126-128. (Adjunct Publication of the 34th Annual ACM Symposium on User Interface Software and Technology, UIST 2021). doi: 10.1145/3474349.3480200

Imai, Yuhei ; Manabe, Hiroyuki. / Single-sided Multi-layer Electric Circuit by Hot Stamping with 3D Printer. Adjunct Publication of the 34th Annual ACM Symposium on User Interface Software and Technology, UIST 2021. Association for Computing Machinery, Inc, 2021. pp. 126-128 (Adjunct Publication of the 34th Annual ACM Symposium on User Interface Software and Technology, UIST 2021).

@inproceedings{4631eaa4e34e415cb4a0fdf602b1c68b,

title = "Single-sided Multi-layer Electric Circuit by Hot Stamping with 3D Printer",

abstract = "The spread of personal computer-Aided fabrication has made it possible for individuals to create things that meet their personal needs. However, it is still not easy for an individual to prototype electronic circuits. Several methods have been proposed for quickly prototyping electronic circuits. Our solution is combining a 3D printer with transfer foil. This paper expands our original circuit printing method so as to fabricate single-sided multi-layer boards. We show that the proposed technique allows a 3D printer and two types of transfer foil to create single-sided multi-layer circuits. ",

keywords = "3D printer, hot stamping, Multi-layer electric circuit, silver paste, transfer foil",

author = "Yuhei Imai and Hiroyuki Manabe",

note = "Funding Information: This work was supported by JSPS KAKENHI Grant Number 20K19851. Publisher Copyright: {\textcopyright} 2021 Owner/Author.; 34th Annual ACM Symposium on User Interface Software and Technology, UIST 2021 ; Conference date: 10-10-2021 Through 14-10-2021",

year = "2021",

month = oct,

day = "10",

doi = "10.1145/3474349.3480200",

language = "English",

series = "Adjunct Publication of the 34th Annual ACM Symposium on User Interface Software and Technology, UIST 2021",

publisher = "Association for Computing Machinery, Inc",

pages = "126--128",

booktitle = "Adjunct Publication of the 34th Annual ACM Symposium on User Interface Software and Technology, UIST 2021",

}

TY - GEN

T1 - Single-sided Multi-layer Electric Circuit by Hot Stamping with 3D Printer

AU - Imai, Yuhei

AU - Manabe, Hiroyuki

PY - 2021/10/10

Y1 - 2021/10/10

N2 - The spread of personal computer-Aided fabrication has made it possible for individuals to create things that meet their personal needs. However, it is still not easy for an individual to prototype electronic circuits. Several methods have been proposed for quickly prototyping electronic circuits. Our solution is combining a 3D printer with transfer foil. This paper expands our original circuit printing method so as to fabricate single-sided multi-layer boards. We show that the proposed technique allows a 3D printer and two types of transfer foil to create single-sided multi-layer circuits.

AB - The spread of personal computer-Aided fabrication has made it possible for individuals to create things that meet their personal needs. However, it is still not easy for an individual to prototype electronic circuits. Several methods have been proposed for quickly prototyping electronic circuits. Our solution is combining a 3D printer with transfer foil. This paper expands our original circuit printing method so as to fabricate single-sided multi-layer boards. We show that the proposed technique allows a 3D printer and two types of transfer foil to create single-sided multi-layer circuits.

KW - 3D printer

KW - hot stamping

KW - Multi-layer electric circuit

KW - silver paste

KW - transfer foil

UR - http://www.scopus.com/inward/record.url?scp=85117952131&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85117952131&partnerID=8YFLogxK

U2 - 10.1145/3474349.3480200

DO - 10.1145/3474349.3480200

M3 - Conference contribution

AN - SCOPUS:85117952131

T3 - Adjunct Publication of the 34th Annual ACM Symposium on User Interface Software and Technology, UIST 2021

SP - 126

EP - 128

BT - Adjunct Publication of the 34th Annual ACM Symposium on User Interface Software and Technology, UIST 2021

PB - Association for Computing Machinery, Inc

T2 - 34th Annual ACM Symposium on User Interface Software and Technology, UIST 2021

Y2 - 10 October 2021 through 14 October 2021

ER -

Single-sided Multi-layer Electric Circuit by Hot Stamping with 3D Printer

Abstract

Publication series

Conference

Keywords

ASJC Scopus subject areas

Access to Document

Other files and links

Fingerprint

Cite this