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Study on low-cycle fatigue testing and therrmal fatigue life prediction of electroplated copper thin film for through hole via
Kazuki Watanabe, Naoyuki Yajima, Yoshiharu Kariya, Yoshiyuki Hiroshima, Shunichi Kikuchi, Akiko Matsui, Hiroshi Shimizu
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution