Abstract
A synthetic criterion to provide guidance for the high-reliability structure design for the level-1 crack-free package is introduced. The criterion reflects a consideration of both delamination and package cracking. According to the criterion, to prevent delamination is the most effective means to realize the level-1 crack-free package for large chips (ex. 15mm square). Therefore, a new package structure, a chip side support (CSS) structure which eliminates a die-pad is proposed and reliability tests are carried out. The CSS package realizes the level-1 crack-free package without moisture-proof packing.
| Original language | English |
|---|---|
| Pages (from-to) | 71-77 |
| Number of pages | 7 |
| Journal | Proceedings - Electronic Components and Technology Conference |
| Publication status | Published - 1996 Jan 1 |
| Event | Proceedings of the 1996 IEEE 46th Electronic Components & Technology Conference, ECTC - Orlando, FL, USA Duration: 1996 May 28 → 1996 May 31 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering