The effect of Ni,Ge elements on microstructure and mechanical properties of Sn-Ag-Cu solders

Masayoshi Shimoda, Noboru Hidaka, Mitsuo Yamashita, Kenichi Sakaue, Takeshi Ogawa

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

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Engineering & Materials Science

Chemical Compounds

Physics & Astronomy