Original language | English |
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Pages (from-to) | 451-457 |
Journal | Proc. of the 7th Symposium on Microjoining and Assembly Technology in Electronics |
Volume | 7 |
Publication status | Published - 2001 Feb 1 |
The Influence of Processing History on the Creep of Tin-3. 5Silver Alloys
William.J.Plumbridge William.J.Plumbridge, Yoshiharu Kariya
Research output: Contribution to journal › Article › peer-review