The Wettability and Bondability Degradation Mechanisms of Tin-plated Copper Leads of Fine Pitch TCP During Thermal and Humid Aging,

E.Hosomi E.Hosomi; C.Takubo C.Takubo; Y.Hiruta Y.Hiruta; T.Sudo T.Sudo; F.Takahashi F.Takahashi; K.Saito K.Saito; N.Nakajima N.Nakajima; M.Nakazono M.Nakazono; Toshio Sudo

The Wettability and Bondability Degradation Mechanisms of Tin-plated Copper Leads of Fine Pitch TCP During Thermal and Humid Aging,

E.Hosomi E.Hosomi, C.Takubo C.Takubo, Y.Hiruta Y.Hiruta, T.Sudo T.Sudo, F.Takahashi F.Takahashi, K.Saito K.Saito, N.Nakajima N.Nakajima, M.Nakazono M.Nakazono, Toshio Sudo

Functional Control Systems

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	128-133
Journal	8th IMC
Publication status	Published - 1994 May 25

Cite this

@article{212be9f25d1744c09654d232ea2b8050,

title = "The Wettability and Bondability Degradation Mechanisms of Tin-plated Copper Leads of Fine Pitch TCP During Thermal and Humid Aging,",

author = "E.Hosomi E.Hosomi and C.Takubo C.Takubo and Y.Hiruta Y.Hiruta and T.Sudo T.Sudo and F.Takahashi F.Takahashi and K.Saito K.Saito and N.Nakajima N.Nakajima and M.Nakazono M.Nakazono and Toshio Sudo",

year = "1994",

month = may,

day = "25",

language = "English",

pages = "128--133",

journal = "8th IMC",

}

TY - JOUR

T1 - The Wettability and Bondability Degradation Mechanisms of Tin-plated Copper Leads of Fine Pitch TCP During Thermal and Humid Aging,

AU - E.Hosomi, E.Hosomi

AU - C.Takubo, C.Takubo

AU - Y.Hiruta, Y.Hiruta

AU - T.Sudo, T.Sudo

AU - F.Takahashi, F.Takahashi

AU - K.Saito, K.Saito

AU - N.Nakajima, N.Nakajima

AU - M.Nakazono, M.Nakazono

AU - Sudo, Toshio

PY - 1994/5/25

Y1 - 1994/5/25

M3 - Article

SP - 128

EP - 133

JO - 8th IMC

JF - 8th IMC

ER -