Thermal Characterization of Resin Die-bond Defects for VLSI Packages

Y.Yamaji Y.Yamaji; Y.Tsuboi Y.Tsuboi; O.Yamagata O.Yamagata; H.Nakayoshi H.Nakayoshi; M.Nii M.Nii; T.Sudo T.Sudo; Toshio Sudo

Thermal Characterization of Resin Die-bond Defects for VLSI Packages

Y.Yamaji Y.Yamaji, Y.Tsuboi Y.Tsuboi, O.Yamagata O.Yamagata, H.Nakayoshi H.Nakayoshi, M.Nii M.Nii, T.Sudo T.Sudo, Toshio Sudo

Functional Control Systems

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	123-126
Journal	The 2nd VLSI Packaging Workshop of Japan,
Publication status	Published - 1994 Dec 5

Cite this

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title = "Thermal Characterization of Resin Die-bond Defects for VLSI Packages",

author = "Y.Yamaji Y.Yamaji and Y.Tsuboi Y.Tsuboi and O.Yamagata O.Yamagata and H.Nakayoshi H.Nakayoshi and M.Nii M.Nii and T.Sudo T.Sudo and Toshio Sudo",

year = "1994",

month = dec,

day = "5",

language = "English",

pages = "123--126",

journal = "The 2nd VLSI Packaging Workshop of Japan,",

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AU - Y.Yamaji, Y.Yamaji

AU - Y.Tsuboi, Y.Tsuboi

AU - O.Yamagata, O.Yamagata

AU - H.Nakayoshi, H.Nakayoshi

AU - M.Nii, M.Nii

AU - T.Sudo, T.Sudo

AU - Sudo, Toshio

PY - 1994/12/5

Y1 - 1994/12/5

M3 - Article

SP - 123

EP - 126

JO - The 2nd VLSI Packaging Workshop of Japan,

JF - The 2nd VLSI Packaging Workshop of Japan,

ER -