Three-Dimensional Passive Circuit Technology For Ultra-Compact MMIC' s

Makoto Hirano, Kenjiro Nishikawa, Ichihiko Toyoda, Shinji Aoyama, Suehiro Sugitani, Kimiyoshi Yamasaki

    Research output: Contribution to journalArticlepeer-review

    53 Citations (Scopus)


    A novel passive circuit technology of a three-dimensional (3-D) metal-insulator structure is developed for ultra-compact MMIC' s. By combining vertical passive elements, such as a wall-like microwire for shielding or coupling, and a pillar-like via connection with multilayer passive circuits, a 3-D passive circuit structure is formed to implement highly dense and more functional MMIC' s. O2/He RIE for forming trenches and holes in a thick plyimide insulator, low-current electroplating for foming gold metal sidewalls in the trenches or holes, and ion-milling with a WSiN stopper layer for patterning the gold metal are used to produce such a structure. The complete 3-D structure provides miniature microstrip lines effectively shielded with a vertical metal-wall, a miniature balun with low-loss vertical wall-like microwires, and inverted microstrip lines jointed with pillar-like vias through a thick polyimide layer. This technology stages next-generation ultra-compact MMIC's by producing various functional passive circuits in a very small area.

    Original languageEnglish
    Pages (from-to)2845-2850
    Number of pages6
    JournalIEEE Transactions on Microwave Theory and Techniques
    Issue number12
    Publication statusPublished - 1995 Dec

    ASJC Scopus subject areas

    • Radiation
    • Condensed Matter Physics
    • Electrical and Electronic Engineering


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