Trends of conductive adhesives in electronics

Katsuaki Suganuma, Daisuke Shindo, Kanji Ohtsuka, Yoshiharu Kariya

Research output: Contribution to journalArticlepeer-review

3 Citations (Scopus)
Original languageEnglish
Pages (from-to)79-85
Number of pages7
JournalJournal of Japan Institute of Electronics Packaging
Issue number1
Publication statusPublished - 2009 Jan

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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