Ultra-smoothness grinding of silicon carbide in depth of cut of 1mm

Heiji Yasui; Yuki Yamamoto; Takekazu Sawa

Ultra-smoothness grinding of silicon carbide in depth of cut of 1mm

Heiji Yasui, Yuki Yamamoto, Takekazu Sawa

Research output: Contribution to conference › Paper › peer-review

Abstract

In our previous researches, the newly devised ultra-smoothness grinding method is proposed and ascertained to be useful for finishing fine ceramics to the ultra-smoothness surface below 30 nm(Rz) or 5 nm(Ra). In the research, the influence of depth of cut on ultra-smoothness grinding of a silicon carbide ceramic is examined. The depth of cut ranges from 5 micro-meters to 1 mm. In the ultra-smoothness grinding method, it is found possible to finish the silicon carbide ceramic to high smoothness surface at even the depth of cut of 1 mm using metal bonded diamond wheel of coarse grain size of #140.

Original language	English
Pages	599-602
Number of pages	4
Publication status	Published - 2005 Jan 1
Externally published	Yes
Event	5th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2005 - Montpellier, France Duration: 2005 May 8 → 2005 May 11

Conference

Conference	5th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2005
Country/Territory	France
City	Montpellier
Period	05/5/8 → 05/5/11

ASJC Scopus subject areas

Industrial and Manufacturing Engineering
Mechanical Engineering
Materials Science(all)
Environmental Engineering
Instrumentation

Cite this

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title = "Ultra-smoothness grinding of silicon carbide in depth of cut of 1mm",

abstract = "In our previous researches, the newly devised ultra-smoothness grinding method is proposed and ascertained to be useful for finishing fine ceramics to the ultra-smoothness surface below 30 nm(Rz) or 5 nm(Ra). In the research, the influence of depth of cut on ultra-smoothness grinding of a silicon carbide ceramic is examined. The depth of cut ranges from 5 micro-meters to 1 mm. In the ultra-smoothness grinding method, it is found possible to finish the silicon carbide ceramic to high smoothness surface at even the depth of cut of 1 mm using metal bonded diamond wheel of coarse grain size of #140.",

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year = "2005",

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AU - Yasui, Heiji

AU - Yamamoto, Yuki

AU - Sawa, Takekazu

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N2 - In our previous researches, the newly devised ultra-smoothness grinding method is proposed and ascertained to be useful for finishing fine ceramics to the ultra-smoothness surface below 30 nm(Rz) or 5 nm(Ra). In the research, the influence of depth of cut on ultra-smoothness grinding of a silicon carbide ceramic is examined. The depth of cut ranges from 5 micro-meters to 1 mm. In the ultra-smoothness grinding method, it is found possible to finish the silicon carbide ceramic to high smoothness surface at even the depth of cut of 1 mm using metal bonded diamond wheel of coarse grain size of #140.

AB - In our previous researches, the newly devised ultra-smoothness grinding method is proposed and ascertained to be useful for finishing fine ceramics to the ultra-smoothness surface below 30 nm(Rz) or 5 nm(Ra). In the research, the influence of depth of cut on ultra-smoothness grinding of a silicon carbide ceramic is examined. The depth of cut ranges from 5 micro-meters to 1 mm. In the ultra-smoothness grinding method, it is found possible to finish the silicon carbide ceramic to high smoothness surface at even the depth of cut of 1 mm using metal bonded diamond wheel of coarse grain size of #140.

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T2 - 5th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2005

Y2 - 8 May 2005 through 11 May 2005

ER -

Ultra-smoothness grinding of silicon carbide in depth of cut of 1mm

Abstract

Conference

ASJC Scopus subject areas

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