TY - GEN
T1 - Ultralow impedance analysis and evaluation of power distribution network for decoupling capacitor embedded interposers of 3-D integrated LSI system
AU - Kikuchi, Katsuya
AU - Ueda, Chihiro
AU - Gomyo, Toshio
AU - Ookubo, Toshikazu
AU - Aoyagi, Masahiro
AU - Sudo, Toshio
AU - Otsuka, Kanji
PY - 2012/10/4
Y1 - 2012/10/4
N2 - We evaluated low-impedance power distribution network (PDN) of decoupling capacitor embedded interposers for 3-D integrated LSI system. Measurements are carried out using the developed impedance analyzer system of a wide frequency range for evaluating ultralow impedance, and calculations are carried out using 2.5-D and 3-D finite element method (FEM) electromagnetic field simulator. We fabricated various types of capacitor mounted or capacitor embedded interposers test element group (TEG), such as surface-mounted and embedded chip capacitors, and thin film capacitors on silicon interposers using the same simple design to compare measurement results with calculation ones. As a result, the ultralow impedance evaluation system that has a high measurement dynamic range at the entire measurable frequency band can be realized. Furthermore, by using 2.5-D and 3-D FEM electromagnetic field simulator, it is expected that the accurate and wideband comparative verification of the PDN impedance analysis and evaluation can be realized.
AB - We evaluated low-impedance power distribution network (PDN) of decoupling capacitor embedded interposers for 3-D integrated LSI system. Measurements are carried out using the developed impedance analyzer system of a wide frequency range for evaluating ultralow impedance, and calculations are carried out using 2.5-D and 3-D finite element method (FEM) electromagnetic field simulator. We fabricated various types of capacitor mounted or capacitor embedded interposers test element group (TEG), such as surface-mounted and embedded chip capacitors, and thin film capacitors on silicon interposers using the same simple design to compare measurement results with calculation ones. As a result, the ultralow impedance evaluation system that has a high measurement dynamic range at the entire measurable frequency band can be realized. Furthermore, by using 2.5-D and 3-D FEM electromagnetic field simulator, it is expected that the accurate and wideband comparative verification of the PDN impedance analysis and evaluation can be realized.
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U2 - 10.1109/ECTC.2012.6248963
DO - 10.1109/ECTC.2012.6248963
M3 - Conference contribution
AN - SCOPUS:84866847239
SN - 9781467319669
T3 - Proceedings - Electronic Components and Technology Conference
SP - 1033
EP - 1039
BT - 2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012
T2 - 2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012
Y2 - 29 May 2012 through 1 June 2012
ER -