Visco-elastic effect of underfill material in reliability analysis of flip-chip package

Yoshihiko Kanda; Kunihiro Zama; Yoshiharu Kariya; Takao Mikami; Takaya Kobayashi; Toshiyuki Sato; Toshiaki Enomoto; Koichi Hirata

doi:10.1115/InterPACK2009-89152

Visco-elastic effect of underfill material in reliability analysis of flip-chip package

Yoshihiko Kanda, Kunihiro Zama, Yoshiharu Kariya, Takao Mikami, Takaya Kobayashi, Toshiyuki Sato, Toshiaki Enomoto, Koichi Hirata

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

The effect of viscoelasticity of underfill on the reliability analysis of flip-chip package by using FEA has been investigated in this study. The analytical result on thermal warpage of a package is different depending on whether the underfill is assumed to be elastic or viscoelastic. The difference is prominent in materials with low T_g, specifically during the cooling process. The viscoelastic effect of the underfill on the fatigue life of the solder bumps is also appears in materials with low T_g, and the predicted fatigue life of a package is about twice as short if the underfill is assumed to be elastic instead of viscoelastic. Thus, the differences in the assumption regarding the viscoelastic properties of the underfill affect the reliability analysis of the packages under thermal cycling condition using FEA.

Original language	English
Title of host publication	Proceedings of the ASME InterPack Conference 2009, IPACK2009
Pages	755-759
Number of pages	5
DOIs	https://doi.org/10.1115/InterPACK2009-89152
Publication status	Published - 2010 Jun 25
Event	2009 ASME InterPack Conference, IPACK2009 - San Francisco, CA, United States Duration: 2009 Jul 19 → 2009 Jul 23

Publication series

Name	Proceedings of the ASME InterPack Conference 2009, IPACK2009
Volume	1

Conference

Conference	2009 ASME InterPack Conference, IPACK2009
Country/Territory	United States
City	San Francisco, CA
Period	09/7/19 → 09/7/23

ASJC Scopus subject areas

Hardware and Architecture
Electrical and Electronic Engineering

Access to Document

10.1115/InterPACK2009-89152

Cite this

Kanda, Y., Zama, K., Kariya, Y., Mikami, T., Kobayashi, T., Sato, T., Enomoto, T., & Hirata, K. (2010). Visco-elastic effect of underfill material in reliability analysis of flip-chip package. In Proceedings of the ASME InterPack Conference 2009, IPACK2009 (pp. 755-759). (Proceedings of the ASME InterPack Conference 2009, IPACK2009; Vol. 1). https://doi.org/10.1115/InterPACK2009-89152

Visco-elastic effect of underfill material in reliability analysis of flip-chip package. / Kanda, Yoshihiko; Zama, Kunihiro; Kariya, Yoshiharu et al.
Proceedings of the ASME InterPack Conference 2009, IPACK2009. 2010. p. 755-759 (Proceedings of the ASME InterPack Conference 2009, IPACK2009; Vol. 1).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Kanda, Y, Zama, K, Kariya, Y, Mikami, T, Kobayashi, T, Sato, T, Enomoto, T & Hirata, K 2010, Visco-elastic effect of underfill material in reliability analysis of flip-chip package. in Proceedings of the ASME InterPack Conference 2009, IPACK2009. Proceedings of the ASME InterPack Conference 2009, IPACK2009, vol. 1, pp. 755-759, 2009 ASME InterPack Conference, IPACK2009, San Francisco, CA, United States, 09/7/19. https://doi.org/10.1115/InterPACK2009-89152

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abstract = "The effect of viscoelasticity of underfill on the reliability analysis of flip-chip package by using FEA has been investigated in this study. The analytical result on thermal warpage of a package is different depending on whether the underfill is assumed to be elastic or viscoelastic. The difference is prominent in materials with low Tg, specifically during the cooling process. The viscoelastic effect of the underfill on the fatigue life of the solder bumps is also appears in materials with low Tg, and the predicted fatigue life of a package is about twice as short if the underfill is assumed to be elastic instead of viscoelastic. Thus, the differences in the assumption regarding the viscoelastic properties of the underfill affect the reliability analysis of the packages under thermal cycling condition using FEA.",

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AU - Sato, Toshiyuki

AU - Enomoto, Toshiaki

AU - Hirata, Koichi

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AB - The effect of viscoelasticity of underfill on the reliability analysis of flip-chip package by using FEA has been investigated in this study. The analytical result on thermal warpage of a package is different depending on whether the underfill is assumed to be elastic or viscoelastic. The difference is prominent in materials with low Tg, specifically during the cooling process. The viscoelastic effect of the underfill on the fatigue life of the solder bumps is also appears in materials with low Tg, and the predicted fatigue life of a package is about twice as short if the underfill is assumed to be elastic instead of viscoelastic. Thus, the differences in the assumption regarding the viscoelastic properties of the underfill affect the reliability analysis of the packages under thermal cycling condition using FEA.

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Visco-elastic effect of underfill material in reliability analysis of flip-chip package

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