Wideband and high-isolation properties of power bus structure by the combination of thin-film embedded capacitor and planar EBG structure

Toshio Sudo, Seiju Ichijo, Takanobu Kushihira

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

Power bus structure in a printed circuit board (PCB) is an influential design parameter in mitigating power/ground fluctuation and radiated emission for high-speed digital circuits. The power bus is ordinarily composed of two solid planes separated by dielectric insulator in a multilayer PCB. Recently, it has been reported that an electromagnetic bandgap (EBG)-type VDD plane is effective for suppressing radiated emission for mixed-signal applications or high-speed digital applications. However, the EBG-type VDD plane often induces large power/ground bounce due to the return current discontinuity. On the other hand, the solid-type VDD and ground plane with a thinner dielectric insulator makes wide band property of the power supply impedance by eliminating the power/ground resonances. However, even adopting an insulator thickness of 16 um, the S21 property was still around -50 dB or so. In the present work, the power bus structure with wideband and high isolation properties of around -80 dB or more has been explored by the combination of thin-film insulator and planar EBG structure.

Original languageEnglish
Title of host publicationProceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07
Pages1212-1217
Number of pages6
DOIs
Publication statusPublished - 2007 Oct 22
Event57th Electronic Components and Technology Conference 2007, ECTC '07 - Sparks, NV, United States
Duration: 2007 May 292007 Jun 1

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Conference

Conference57th Electronic Components and Technology Conference 2007, ECTC '07
Country/TerritoryUnited States
CitySparks, NV
Period07/5/2907/6/1

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Fingerprint

Dive into the research topics of 'Wideband and high-isolation properties of power bus structure by the combination of thin-film embedded capacitor and planar EBG structure'. Together they form a unique fingerprint.

Cite this