WLAN/WPAN

Research output: Contribution to journal › Editorial › peer-review

Original language	English
Article number	4523203
Pages (from-to)	354
Number of pages	1
Journal	Digest of Technical Papers - IEEE International Solid-State Circuits Conference
Volume	51
DOIs	https://doi.org/10.1109/ISSCC.2008.4523203
Publication status	Published - 2008
Externally published	Yes
Event	2008 IEEE International Solid State Circuits Conference, ISSCC - San Francisco, CA, United States Duration: 2008 Feb 3 → 2008 Feb 7

ASJC Scopus subject areas

@article{0acb5b9e81d44320a65fcfaebbd1839b,

title = "WLAN/WPAN",

author = "Arya Behzad and Tadashi Maeda",

year = "2008",

doi = "10.1109/ISSCC.2008.4523203",

language = "English",

volume = "51",

pages = "354",

journal = "Digest of Technical Papers - IEEE International Solid-State Circuits Conference",

issn = "0193-6530",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

note = "2008 IEEE International Solid State Circuits Conference, ISSCC ; Conference date: 03-02-2008 Through 07-02-2008",

}

TY - JOUR

T1 - WLAN/WPAN

AU - Behzad, Arya

AU - Maeda, Tadashi

PY - 2008

Y1 - 2008

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U2 - 10.1109/ISSCC.2008.4523203

DO - 10.1109/ISSCC.2008.4523203

M3 - Editorial

AN - SCOPUS:49549087967

SN - 0193-6530

VL - 51

SP - 354

JO - Digest of Technical Papers - IEEE International Solid-State Circuits Conference

JF - Digest of Technical Papers - IEEE International Solid-State Circuits Conference

M1 - 4523203

T2 - 2008 IEEE International Solid State Circuits Conference, ISSCC

Y2 - 3 February 2008 through 7 February 2008

ER -