電子工学科

236 Article
171 Conference contribution
22 Conference article
12 Paper
その他

12 件

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2018

Word Level Language Identification of Code Mixing Text in Social Media
Premachandra, C., 2018 12月.
研究成果: Paper › 査読
2014
Reducing signal transmission loss by low surface roughness
Okubo, T. A., Sudo, T., Hosoi, T., Tsuyoshi, H. & Kuwako, F., 2014 1月 1.
研究成果: Paper › 査読
1 被引用数 (Scopus)
Signal transmission loss due to copper surface roughness in high-frequency region
Liew, E., Malaysia, M. C. F., Malaysia, S. A., Okubo, T. A., Sudo, T., Hosoi, T., Tsuyoshi, H. & Kuwako, F., 2014 1月 1.
研究成果: Paper › 査読
6 被引用数 (Scopus)
2013
Power integrity behavior for various packaging environments
Terasaki, M., Kiyosige, S., Ichimura, W., Kobayashi, R., Kubo, G., Otsuka, H. & Sudo, T., 2013 1月 1.
研究成果: Paper › 査読
2 被引用数 (Scopus)
Ultra-wideband noise suppression of power supply noise by combining mushroom and planar type EBG structures
Ikemiya, K., Sakai, M. & Sudo, T., 2013 1月 1.
研究成果: Paper › 査読
1 被引用数 (Scopus)
2005
Interferometric optical isolator with Si gudiing layer operated in unidirectional magnetic field
Yokoi, H., 2005 12月 1, p. 450-457. 8 p.
研究成果: Paper › 査読
Reliability of damascene copper interconnects
Ueno, K., Ishigarni, T., Kakuhara, Y. & Kawano, M., 2005, p. 408-418. 11 p.
研究成果: Paper › 査読
1 被引用数 (Scopus)
2003
TE-TM Mode conversion optical isolator fabricated by wafer bonding
Yokoi, H., Mizumoto, T. & Iwasaki, H., 2003 12月 1, p. 130-136. 7 p.
研究成果: Paper › 査読
2002
Physical properties of MOD derived Bi₄Ti₃O₁₂/Bi₂SiO₅/Si structures
Yamaguchi, M., Nagatomo, T. & Masuda, Y., 2002, p. 231-234. 4 p.
研究成果: Paper › 査読
3 被引用数 (Scopus)
2000
Fabrication and properties of Bi₂SiO₅ thin films for MFIS structures
Yamaguchi, M., Hiraki, K., Homma, T., Nagatomo, T. & Masuda, Y., 2000, p. 629-632. 4 p.
研究成果: Paper › 査読
5 被引用数 (Scopus)
1998
Low temperature wafer direct bonding between GaInAsP etch stop layer and Gd₃Ga₅O₁₂
Yokoi, H. & Mizumoto, T., 1998 1月 1. 1 p.
研究成果: Paper › 査読
1988
New polyimide siloxane film for interlayer dielectrics in sub-micron multilevel interconnection.
Homma, T., Eguchi, K., Numasawa, Y., Kikkawa, T., Hokari, Y. & Hamano, K., 1988, p. 279-285. 7 p.
研究成果: Paper › 査読
1 被引用数 (Scopus)

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