苅谷 義治

研究成果

年別の研究成果 1993 1998 1999 2001 2003 2004 2005 2008 2010 2012 2016 2019 2022

• 103 Article
• 24 Conference contribution
• 3 Editorial
• 2 Paper
• 1 その他
  • 1 Conference article

年別の研究成果

年別の研究成果

検索結果

• 1993

  Infrared Emission Spectra of a Thin film of Molten Alkali-metal Nitrates

  Maeda, M. & Kariya, Y., 1993 1月 1, In: ISIJ International. 33, p. 182-187

  研究成果: Article › 査読

  6 被引用数 (Scopus)
• 1997

  Effect of Solidification Speed on the Isothermal Fatigue properties of Sn-3.5mass%Ag Solder Alloy

  Kariya, Y., Oguchi, Y., Kawamata, H. & Otsuka, M., 1997 10月 1, In: Proc. of Fifth Japan International SAMPE Symposium. 5, p. 1673-1678

  研究成果: Article › 査読

• Isothermal Fatigue Characteristics of Sn-3.5Ag-X(Bi,Cu,Zn)Solder Alloy

  Kariya, Y. & Otsuka, M., 1997 10月 1, In: Proc. of Fifth Japan International SAMPE Symposium. 5, p. 1679-1684

  研究成果: Article › 査読
• 1998

  Effect of bismuth on the isothermal fatigue properties of Sn-3.5mass%Ag solder alloy

  Kariya, Y. & Otsuka, M., 1998 7月, In: Journal of Electronic Materials. 27, 7, p. 866-870 5 p.

  研究成果: Article › 査読

  • Bismuth 100%
  • fatigue life 99%
  • Solder 92%
  • solders 83%
  • bismuth 73%
  84 被引用数 (Scopus)

• Effect of Bismuth on the Isoｔhermal Fatigue Properties of Sn-3.5mass%Ag Solder Alloy

  Kariya, Y. & Otsuka, M., 1998 7月 1, In: Proc. Internatinal Symposium on Microstructures and Mechanical Properties of New Engineering Materials. p. 171-176

  研究成果: Article › 査読

  84 被引用数 (Scopus)

• Mechanical Fatigue Characteristics of Sn-3.5Ag-X(Bi,Cu,Zn) Solder Alloy

  Kariya, Y. & Otsuka, M., 1998 2月 1, In: Default journal.

  研究成果: Article › 査読

• Mechanical fatigue characteristics of Sn-3.5Ag-X (X=Bi, Cu, Zn and In) solder alloys

  Kariya, Y. & Otsuka, M., 1998 11月, In: Journal of Electronic Materials. 27, 11, p. 1229-1235 7 p.

  研究成果: Article › 査読

  • Mechanical Fatigue 100%
  • Solder 66%
  • fatigue life 61%
  • solders 60%
  • Soldering alloys 52%
  157 被引用数 (Scopus)

• Mechanical Fatigue Characteristics of Sn-3.5mass%Ag-X(X=Bi, Cu, Zn and In) Solder Alloys

  Kariya, Y. & Otsuka, M., 1998 7月 1, In: Journal of Electronic Materials. 27, p. 1229-1235

  研究成果: Article › 査読

• Microstructure and Isothermal Fatigue Characteristics of Sn-Ag-X(X=Bi,Cu,Zn) Solder Alloys and Solder/Copper Joint

  Kariya, Y., Oguchi, Y. & Otsuka, M., 1998 4月 1, In: Default journal.

  研究成果: Article › 査読
• 1999

  Effect of Additional Element (Bi and Cu) on the Thermal Fatigue Strength of QFP/Sn-3.5Ag Solder Joint

  Kariya, Y., Hirata, Y., Warashina, K. & Otsuka, M., 1999 12月 1, In: American Society of Mechanical Engineers, EEP. 26 3, p. 173-180 8 p.

  研究成果: Article › 査読

  • Thermal fatigue 100%
  • Soldering alloys 79%
  • Bismuth 54%
  • Fatigue damage 28%
  • Fatigue of materials 27%
  1 被引用数 (Scopus)

• Effect of Bismuth and Copper on the Creep Properties of Sn-3.5Ag Solder Alloy

  Atsumi, K., Kariya, Y. & Ostuka, M., 1999 2月 1, In: Default journal.

  研究成果: Article › 査読

• Effect of Strain Rate and Hold Time on the Isothermal Fatigue Life of Sn-3.5Ag-X(Bi,Cu,In) Solder Alloys

  Kariya, Y. & Otsuka, M., 1999 3月 1, In: Default journal.

  研究成果: Article › 査読

• Effect of thermal cycles on the mechanical strength of quad flat pack leads/Sn-3.5Ag-X (X=Bi and Cu) solder joints

  Kariya, Y., Hirata, Y. & Otsuka, M., 1999 3月 1, In: Default journal.

  研究成果: Article › 査読

  59 被引用数 (Scopus)

• Effect of thermal cycles on the mechanical strength of quad flat pack leads/Sn-3.5Ag-X (X = Bi and Cu) solder joints

  Kariya, Y., Hirata, Y. & Otsuka, M., 1999 11月, In: Journal of Electronic Materials. 28, 11, p. 1263-1269 7 p.

  研究成果: Article › 査読

  • Solder 100%
  • Thermal Fatigue 92%
  • solders 90%
  • Strength of materials 84%
  • Soldering alloys 79%
  59 被引用数 (Scopus)

• Evaluation of Wetting Properties for Sn-Ag-X System Solder by modified Wetting Balance Technique

  Nakamura, K., Kariya, Y. & Otsuka, M., 1999 2月 1, In: Default journal.

  研究成果: Article › 査読

• Thermal Fatigue Damage of Quad Flat Pack Leads and Sn-3.5Ag-X(x=Bi and Cu) Solder Joints

  Warashina, K., Kariya, Y., Hirata, Y. & Otsuka, M., 1999 2月 1, In: Default journal.

  研究成果: Article › 査読
• 2000

  Allotropic transformation study and phase mapping in tin-copper lead free solder for electronics assembly

  Kariya, Y., Williams, N., Gagg, C. & Plumbridge, W. J., 2000 6月 1, In: Default journal.

  研究成果: Article › 査読

• Current Soldering Technology and Reliability Issue in Lead-Free Solder for Electronic Assembly

  Kariya, Y. & Otsuka, M., 2000, In: Yosetsu Gakkai Shi/Journal of the Japan Welding Society. 69, 2, p. 108-112 5 p.

  研究成果: Article › 査読
  2 被引用数 (Scopus)

• Infrared Emission Spectra of CaF2-Cao-SiO2 Melt

  Ueda, S., Koyo, H., Ikeda, T., Kariya, Y. & Maeda, M., 2000 8月 1, In: ISIJ International. 40, p. 739-743

  研究成果: Article › 査読

  34 被引用数 (Scopus)

• Interfacial Microstructure and Mechanical Reliability of Sn-Ag Solder Joint on Electroless Ni-P Film

  Kariya, Y., Nakamura, K., Tanaka, Y. & Otsuka, M., 2000 3月 1, In: Default journal.

  研究成果: Article › 査読
• 2001

  Allotropic transformation of tin in Sn-0.5mass%Cu Lead-free Solder

  Karriya, Y., Williams, N., Gagg, C., Plumbridge, W. J. & Kariya, Y., 2001 6月 1, In: JOM. 53, p. 39-41

  研究成果: Article › 査読

• Assessment of Low-Cycle Fatigue Life of Sn-3.5mass%Ag-X (X=Bi or Cu) Alloy by Strain Range Partitioning Approach

  Kariya, Y., Morihata, T. & Otsuka, M., 2001 9月 1, In: Journal of Electronic Materials. 30, p. 1184-1189

  研究成果: Article › 査読

  46 被引用数 (Scopus)

• Assessment of low-cycle fatigue life of Sn-3.5mass%Ag-X (X = Bi or Cu) alloy by strain range partitioning approach

  Kariya, Y., Morihata, T., Hazawa, E. & Otsuka, M., 2001 9月, In: Journal of Electronic Materials. 30, 9, p. 1184-1189 6 p.

  研究成果: Article › 査読

  • fatigue life 100%
  • Creep 64%
  • Alloy 52%
  • Strain 52%
  • Fatigue of materials 51%
  46 被引用数 (Scopus)

• Mechanical Properties of Sn-3.0mass%Ag-0.5mass%Cu Alloy

  Kariya, Y. & William.J.Plumbridge, W. J. P., 2001 2月 1, In: Proc. of the 7th Symposium on Microjoining and Assembly Technology in Electronics. 7, p. 383-388

  研究成果: Article › 査読

• The Influence of Processing History on the Creep of Tin-3. 5Silver Alloys

  William.J.Plumbridge, W. J. P. & Kariya, Y., 2001 2月 1, In: Proc. of the 7th Symposium on Microjoining and Assembly Technology in Electronics. 7, p. 451-457

  研究成果: Article › 査読

• Tin Pest in Lead Free Solders

  Kariya, Y., Gagg, C. & Plumbridge, W. J., 2001 1月 1, In: Soldering and Surface Mount Technology. 13, p. 39-41

  研究成果: Article › 査読

  46 被引用数 (Scopus)

• Tin pest in lead-free solders

  Kariya, Y., Gagg, C. & Plumbridge, W. J., 2001, In: Soldering and Surface Mount Technology. 13, 1, p. 39-40 2 p.

  研究成果: Article › 査読

  • Lead-free solders 100%
  • Tin 94%
  • solders 90%
  • tin 75%
  • Low temperature effects 36%
  46 被引用数 (Scopus)

• Tin pest in Sn-0.5 wt.% Cu lead-free solder

  Kariya, Y., Williams, N., Gagg, C. & Plumbridge, W., 2001 6月, In: JOM. 53, 6, p. 39-41 3 p.

  研究成果: Article › 査読

  • Lead-free solders 100%
  • Tin 94%
  • Solder 33%
  • Chemical Transformation 25%
  • Soldering alloys 19%
  52 被引用数 (Scopus)
• 2002

  Isothermal Shear Fatigue Properties of Lead-Free CSP/PWB Interconnects

  Kariya, Y. & Otsuka, M., 2002 3月 14, In: Default journal.

  研究成果: Article › 査読

• Low Cycle Fatigue life of Lead-Free CSP/PWB Interconnects

  Kariya, Y., Hoshoi, T. & Otsuka, M., 2002 2月 17, In: Default journal.

  研究成果: Article › 査読
• 2003

  Development of lead free solder alloy for flip chip application

  Kariya, Y., 2003 12月 1, In: Default journal.

  研究成果: Article › 査読

• Effect of Silver Content on Thermal Fatigue Life of Sn-xAg-0.5Cu Flip Chip Interconnects

  Terashima, S., Kariya, Y., Hosoi, T. & Tanaka, M., 2003 12月 1, In: Journal of Electronic Materials. 32, p. 1527-1533

  研究成果: Article › 査読

  166 被引用数 (Scopus)

• Effect of Silver Content on Thermal Fatigue Life of Sn-xAg-0.5Cu Flip-Chip Interconnects

  Terashima, S., Kariya, Y., Hosoi, T. & Tanaka, M., 2003 12月, In: Journal of Electronic Materials. 32, 12, p. 1527-1533 7 p.

  研究成果: Article › 査読

  • Thermal Fatigue 100%
  • thermal fatigue 84%
  • fatigue life 78%
  • Thermal fatigue 71%
  • Silver 63%
  166 被引用数 (Scopus)

• Fatigue Life Enhancement of Low Silver Content Sn-Ag-Cu Flip-Chip Interconnects by Small Amount of Ni Addition

  Kariya, Y., Kimura, T., Terashiama, S., Tanaka, M. & Suga, T., 2003 10月 1, In: Default journal.

  研究成果: Article › 査読

• Isothermal Fatigue Properties of Lead-Free BGA joints

  Kariya, Y., Hosoi, T. & Otsuka, M., 2003 3月 1, In: Default journal.

  研究成果: Article › 査読

• Isothermal Shear Fatigue Life of Sn-xAg-0.5Cu Flip Chip Interconnects

  Kariya, Y., Hosoi, T., Terashima, S., Tanaka, M. & Otsuka, M., 2003 7月 6, In: ASME IPACK2003. p. 155-160

  研究成果: Article › 査読

• Mechanical reliability Assecement technique for lead－free solder using miniature scale specimen

  Kariya, Y., 2003 12月 1, In: Default journal.

  研究成果: Article › 査読

• The Constitutive Creep Equation for a Eutectic Sn-Ag Alloy Using the Modified Theta-Projection Concept

  Kariya, Y., Otsuka, M. & Plumbridge, W. J., 2003 12月, In: Journal of Electronic Materials. 32, 12, p. 1398-1402 5 p.

  研究成果: Article › 査読

  • Creep 100%
  • Eutectics 85%
  • eutectics 78%
  • projection 64%
  • Alloy 56%
  31 被引用数 (Scopus)

• The Constitutive Creep Equation of Eutectic Sn-Ag alloy using the Modified Theta Projection Concept

  Kariya, Y. & Otsuka, M., 2003 12月 1, In: Journal of Electronic Materials. 32, p. 1398-1402

  研究成果: Article › 査読
• 2004

  Effect of silver content on the shear fatigue properties of Sn-Ag-Cu Flip Chip Interconnects

  Kariya, Y., Hosoi, T., Terashima, S., Tanaka, M. & Otsuka, M., 2004 4月 1, In: Journal of Electronic Materials. 33, p. 321-328

  研究成果: Article › 査読

  84 被引用数 (Scopus)

• Effect of Silver Content on the Shear Fatigue Properties of Sn-Ag-Cu Flip-Chip Interconnects

  Kariya, Y., Hosoi, T., Terashima, S., Tanaka, M. & Otsuka, M., 2004 4月, In: Journal of Electronic Materials. 33, 4, p. 321-328 8 p.

  研究成果: Article › 査読

  • Solder 100%
  • solders 90%
  • Silver 88%
  • Soldering alloys 79%
  • Shear 74%
  84 被引用数 (Scopus)

• Effect of Stress Relaxation on Low Cycle Fatigue Life of Pb-free Solder Joints

  Kariya, Y. & Suga, T., 2004 3月 1, In: Proc. of 1st Eco Design Symposium in CHINA. 1, p. 111-116

  研究成果: Article › 査読

• Improvement on thermal fatigue properties of Sn-1.2Ag-0.5Cu flip chip interconnects by nickel addition

  Terashima, S., Kariya, Y. & Tanaka, M., 2004 3月 1, In: METARIALS TRANSACTIONS. 45, p. 673-680

  研究成果: Article › 査読

  30 被引用数 (Scopus)

• Improvement on thermal fatigue properties of Sn-1.2Ag-0.5Cu flip chip interconnects by nickel addition

  Terashima, S., Kariya, Y. & Tanaka, M., 2004 3月, In: Materials Transactions. 45, 3, p. 673-680 8 p.

  研究成果: Article › 査読

  Open Access

  • Thermal Fatigue 100%
  • thermal fatigue 84%
  • Thermal fatigue 71%
  • Solder 60%
  • solders 54%
  30 被引用数 (Scopus)

• Low cycle fatigue properties of Ni added low silver content Sn-Ag-Cu flip chip interconnects

  Kariya, Y., Hosoi, T., Kimura, T., Terashima, S. & Tanaka, M., 2004 3月, In: Materials Transactions. 45, 3, p. 689-694 6 p.

  研究成果: Article › 査読

  Open Access

  • Silver 100%
  • silver 75%
  • chips 72%
  • Alloy 64%
  • Fatigue of materials 63%
  14 被引用数 (Scopus)

• Mechanial Fatigue Properties of Through-Hole Joints at Elevated Temperature

  Niimi, T., Kariya, Y. & Suga, T., 2004 9月 1, In: Default journal.

  研究成果: Article › 査読

• Mechanical Properties of Lead Free Solder Alloys Evaluated by Miniature Size Specimen

  Kariya, Y., Arai, T., Suga, T. & Otsuka, M., 2004 11月 30, In: TMS Letters. 1, p. 169-170

  研究成果: Article › 査読

• Mechanical Properties of lead free solder eｖaluated by miniature size specimen

  Kariya, Y., Asai, T., Suga, T. & Otsuka, M., 2004 9月 1, In: Default journal.

  研究成果: Article › 査読

• Structural integrity in electronics

  Plumbridge, W. J. & Kariya, Y., 2004 8月 1, In: Fatigue and Fracture of Engineering Materials and Structures. 27, 8, p. 723-734 12 p.

  研究成果: Article › 査読

  • Nuclear Power 100%
  • Fracture Mechanics 99%
  • Solder 81%
  • Structural integrity 70%
  • Electronic equipment 55%
  9 被引用数 (Scopus)
• 2005

  Isothermal Fatigue Properties of Lead-Free Solder Alloy Evaliated Miniature Size Specimen

  Kariya, Y., Niimi, T. & Suga, T., 2005 7月 1, In: Default journal.

  研究成果: Article › 査読