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• Article

  Thermal Analysis of the Double-Crucible Method in Continuous Silicon Czochralski Processing: I. Experimental Analysis

  Ono, N., Kida, M., Arai, Y. & Sahira, K., 1993 7月, In: Journal of the Electrochemical Society. 140, 7, p. 2101-2105 5 p.

  研究成果: Article › 査読
  1 被引用数 (Scopus)

• Thermal Analysis on Double-Crucible Method in Continuous Silicon CZ Technology I

  Ono, N., Kida, M., Arai, Y. & Sahira, K., 1993 7月 1, In: Journal of the Electrochemical Society. 140, p. 2101-2105

  研究成果: Article › 査読

  7 被引用数 (Scopus)

• Thermal Analysis on Double-Crucible Method in Continuous Silicon CZ Technology II

  Ono, N., Kida, M., Arai, Y. & Sahira, K., 1993 7月 1, In: Journal of the Electrochemical Society. 140, p. 2106-2111

  研究成果: Article › 査読

  6 被引用数 (Scopus)

• Thermal and Electrical Conductivity of Ge₁Sb₄Te₇ Chalcogenide Alloy

  Lan, R., Endo, R., Kuwahara, M., Kobayashi, Y. & Susa, M., 2017 2月 1, In: Journal of Electronic Materials. 46, 2, p. 955-960 6 p.

  研究成果: Article › 査読
  5 被引用数 (Scopus)

• Thermal and magnetic behaviors of a melt-textured superconducting bulk magnet in the zero-field-cooling magnetizing process

  Oka, T., Yokoyama, K., Fujishiro, H. & Noto, K., 2009, In: Superconductor Science and Technology. 22, 6, 065014.

  研究成果: Article › 査読
  4 被引用数 (Scopus)

• Thermal and mechanical coupling in granular modeling for metal injection molding

  Iwai, T., Aizawa, T. & Kihara, J., 1994 4月, In: Journal of Materials Processing Tech.. 42, 2, p. 175-185 11 p.

  研究成果: Article › 査読
  8 被引用数 (Scopus)

• Thermal and mechanical coupling in granular modeling for metal injection molding.

  Iwai, T., Aizawa, T. & Kihara, J., 1800, In: J. Materials Processing Technology.. 42 (1994), p. 175-185

  研究成果: Article › 査読

• Thermal and x-ray analyses of high temperature superconductor YBa2Cu3O6.74

  Kikuchi, M., Syono, Y., Tokiwa, A., Oh-Ishi, K., Arai, H., Hiraga, K., Kobayashi, N. & Sasaoka, T., 1987 6月, In: Japanese Journal of Applied Physics. 26, 6A, p. 1066-1099 34 p.

  研究成果: Article › 査読
  9 被引用数 (Scopus)

• Thermal annealing behavior of defects induced by ion implantation in thermally grown SiO2 films

  Seol, K. S., Karasawa, T., Ohki, Y., Nishikawa, H. & Takiyama, M., 1997 1月 1, In: Microelectrons Engineering. 36, p. 193-195

  研究成果: Article › 査読

  2 被引用数 (Scopus)

• Thermal annealing behavior of defects induced by ion implantation in thermally grown SiO₂ films

  Seol, K. S., Karasawa, T., Ohki, Y., Nishikawa, H. & Takiyama, M., 1997 6月, In: Microelectronic Engineering. 36, 1-4, p. 193-195 3 p.

  研究成果: Article › 査読
  2 被引用数 (Scopus)

• Thermal annealing effects on Ni/Au based Schottky contacts on n-GaN and AlGaN/GaN with insertion of high work function metal

  Miura, N., Nanjo, T., Suita, M., Oishi, T., Abe, Y., Ozeki, T., Ishikawa, H., Egawa, T. & Jimbo, T., 2004 5月 1, In: Solid-State Electronics. 48, 5, p. 689-695 7 p.

  研究成果: Article › 査読
  113 被引用数 (Scopus)

• Thermal-assisted back-extraction of inert platinum group metals from [Hbet][Tf₂N] ionic liquid phase to oxalic acid aqueous solution

  Kono, S., Arai, T. & Takao, K., 2021, In: Journal of Nuclear Science and Technology. 58, 8, p. 941-946 6 p.

  研究成果: Article › 査読
  2 被引用数 (Scopus)

• Thermal behavior and field-trapping property of melt-textured superconducting bulk magnets activated by quasi-static magnetic fields

  Oka, T., Yokoyama, K., Fujishiro, H. & Noto, K., 2009, In: Journal of Physics: Conference Series. 150, 5, 052195.

  研究成果: Article › 査読

  Open Access
  2 被引用数 (Scopus)

• Thermal Characterization of Resin Die-bond Defects for VLSI Packages

  Y.Yamaji, Y. Y., Y.Tsuboi, Y. T., O.Yamagata, O. Y., H.Nakayoshi, H. N., M.Nii, M. N., T.Sudo, T. S. & Sudo, T., 1994 12月 5, In: The 2nd VLSI Packaging Workshop of Japan,. p. 123-126

  研究成果: Article › 査読

• Thermal Comfort and Productivity - Evaluation of Workplace Environment

  Akimoto, T., 2008 7月 1, In: International Symposium on the Interaction between Human and Building Environment (Seoul, Korea).

  研究成果: Article › 査読

• Thermal comfort and productivity - Evaluation of workplace environment in a task conditioned office

  Akimoto, T., Tanabe, S. I., Yanai, T. & Sasaki, M., 2010 1月, In: Building and Environment. 45, 1, p. 45-50 6 p.

  研究成果: Article › 査読
  138 被引用数 (Scopus)

• Thermal comfort and productivity in offices under mandatory electricity savings after the Great East Japan earthquake

  Tanabe, S. I., Iwahashi, Y., Tsushima, S. & Nishihara, N., 2013 2月 1, In: Architectural Science Review. 56, 1, p. 4-13 10 p.

  研究成果: Article › 査読
  59 被引用数 (Scopus)

• Thermal Comfort and Productivity with Three Different Task Conditioning Systems

  T.Akimoto, T. A., Tanabe, S., Amai, H., Genma, T. & Akimoto, T., 2005 10月 1, In: Default journal.

  研究成果: Article › 査読

• Thermal Comfort for Pedestrians in the Street in Japanese Cities in Summer

  MIURA.Masao, MIURA. M. & Miura, M., 1994 9月 17, In: Proceedings of 14th EAROPH World Planning Congress 1994 in BEIJING. p. 398-402

  研究成果: Article › 査読

• Thermal Comfort in Japanese Cities in Summer

  MIURA, M., 1993 9月 28, In: Congress Report of IFHP International Congress 1993 in Helsinki.

  研究成果: Article › 査読

• Thermal conductivities and conduction mechanisms of Sb-Te Alloys at high temperatures

  Lan, R., Endo, R., Kuwahara, M., Kobayashi, Y. & Susa, M., 2011 7月 15, In: Journal of Applied Physics. 110, 2, 023701.

  研究成果: Article › 査読
  2 被引用数 (Scopus)

• Thermal conductivity across the metal-insulator transition in the single-crystalline hyperkagome antiferromagnet Na3+xIr3 O8

  Fauqué, B., Xu, X., Bangura, A. F., Hunter, E. C., Yamamoto, A., Behnia, K., Carrington, A., Takagi, H., Hussey, N. E. & Perry, R. S., 2015 2月 25, In: Physical Review B - Condensed Matter and Materials Physics. 91, 7, 075129.

  研究成果: Article › 査読
  12 被引用数 (Scopus)

• Thermal conductivity and structural instability in La- and Cu-site-substituted La2CuO4

  Sera, M., Maki, M., Hiroi, M., Kobayashi, N., Suzuki, T. & Fukase, T., 1995, In: Physical Review B. 52, 2, p. R735-R738

  研究成果: Article › 査読
  7 被引用数 (Scopus)

• Thermal conductivity and themoelectric power of DyBaCuO bulk superconductor

  Fujishiro, H., Nariki, S., Murakami, M. & Saito, M., 2007 10月 21, In: 5th International Workshop on Processing and Applications of Superconducting (RE)BCO Large Grain Materials. p. 21PP03

  研究成果: Article › 査読

• Thermal conductivity and thermoelectric power of DyBaCuO bulk superconductors

  Fujishiro, H., Nariki, S. & Murakami, M., 2006 7月, In: Superconductor Science and Technology. 19, 7, p. S447-S450

  研究成果: Article › 査読
  13 被引用数 (Scopus)

• Thermal conductivity and thermoelectric power of DyBaCuO superconductors

  Fujishiro, H., Nariki, S., Murakami, M. & Saito, M., 2006 7月 1, In: Superconductor Science and Technology. 19, p. S447-S450

  研究成果: Article › 査読

• Thermal conductivity measurements and prediction for molten silicate slags with dispersing CaO phases

  Susa, M., Tsuchida, N., Endo, R. & Kobayashi, Y., 2009, In: Tetsu-To-Hagane/Journal of the Iron and Steel Institute of Japan. 95, 3, p. 289-296 8 p.

  研究成果: Article › 査読

  Open Access
  7 被引用数 (Scopus)

• Thermal conductivity measurements and prediction for R₂O-CaO- SiO₂ (R=Li, Na, K) slags

  Ozawa, S., Endo, R. & Susa, M., 2007 6月, In: Tetsu-To-Hagane/Journal of the Iron and Steel Institute of Japan. 93, 6, p. 416-423 8 p.

  研究成果: Article › 査読

  Open Access
  2 被引用数 (Scopus)

• Thermal-conductivity measurements and predictions for Ni-Cr solid solution alloys

  Endo, R., Shima, M. & Susa, M., 2010 10月, In: International Journal of Thermophysics. 31, 10, p. 1991-2003 13 p.

  研究成果: Article › 査読
  30 被引用数 (Scopus)

• Thermal conductivity measurements of solid Sb₂Te₃ by hot-strip method

  Lan, R., Endo, R., Kuwahara, M., Kobayashi, Y. & Susa, M., 2010 7月, In: Japanese Journal of Applied Physics. 49, 7 PART 1, p. 780031-780032 2 p.

  研究成果: Article › 査読
  8 被引用数 (Scopus)

• Thermal conductivity of 2CaO SiO₂ bearing solid solution

  Kobayashi, Y., Yiming, T., Takahashi, S. & Endo, R., 2017, In: ISIJ International. 57, 10, p. 1698-1702 5 p.

  研究成果: Article › 査読

  Open Access
  1 被引用数 (Scopus)

• Thermal conductivity of CaO-SiO₂-Al₂O₃ glassy slags: Its dependence on molar ratios of Al₂O₃/CaO and SiO₂/Al₂O₃

  Susa, M., Watanabe, M., Ozawa, S. & Endo, R., 2007 3月, In: Ironmaking and Steelmaking. 34, 2, p. 124-130 7 p.

  研究成果: Article › 査読
  10 被引用数 (Scopus)

• Thermal conductivity of Er-Ba-Cu-O and Ho-Ba-Cu-O superconducting bulks

  Naito, T., Fujishiro, H., Iida, K., Nariki, S. & Murakami, M., 2008 8月 1, In: Superconductor Science and Technology. 21, 8, 085001.

  研究成果: Article › 査読
  1 被引用数 (Scopus)

• Thermal conductivity of oxide scale thermally grown on iron substrate corrected by temperature-dependent interfacial thermal resistance in laser flash measurement

  Li, M., Endo, R., Akoshima, M., Tanei, H., Okada, H. & Susa, M., 2019 3月, In: ISIJ International. 59, 3, p. 398-403 6 p.

  研究成果: Article › 査読

  Open Access
  6 被引用数 (Scopus)

• Thermal cyclic properties of ti-pd-pt-zr high-temperature shape memory alloys

  Tasaki, W., Shimojo, M. & Yamabe-Mitarai, Y., 2019 11月, In: Crystals. 9, 11, 595.

  研究成果: Article › 査読

  Open Access
  3 被引用数 (Scopus)

• Thermal decomposition of ammonia borane at high pressures

  Nyĺn, J., Sato, T., Soignard, E., Yarger, J. L., Stoyanov, E. & Häussermann, U., 2009, In: Journal of Chemical Physics. 131, 10, 104506.

  研究成果: Article › 査読
  54 被引用数 (Scopus)

• Thermal design for wick recirculation of AMTEC cells

  Tanaka, K., 1997, In: KAGAKU KOGAKU RONBUNSHU. 23, 2, 1 p.

  研究成果: Article › 査読

  Open Access
  1 被引用数 (Scopus)

• Thermal Designing on Wick Return AMTEC Cells

  Tanaka, K., Williams, R. M., Underwood, M. L., Ryan, M. A. & Nakamura, A., 1993 6月 1, In: Default journal. p. 731-735

  研究成果: Article › 査読

• Thermal Diffusivity and Conductivity of Fe₃O₄Scale Provided by Oxidation of Iron

  Li, M., Akoshima, M., Endo, R., Ueda, M., Tanei, H. & Susa, M., 2022, In: ISIJ International. 62, 1, p. 275-277 3 p.

  研究成果: Article › 査読

  Open Access
  1 被引用数 (Scopus)

• Thermal diffusivity measurement of oxide scale formed on steel during hot-rolling process

  Endo, R., Yagi, T., Ueda, M. & Susa, M., 2014, In: ISIJ International. 54, 9, p. 2084-2088 5 p.

  研究成果: Article › 査読

  Open Access
  19 被引用数 (Scopus)

• Thermal Effects of Brillouin Gain Spectra in Singlemode Fibers

  Kurashima, T., Horiguchi, T. & Tateda, M., 1990 10月, In: IEEE Photonics Technology Letters. 2, 10, p. 718-720 3 p.

  研究成果: Article › 査読
  77 被引用数 (Scopus)

• Thermal effects on the Brillouin frequency shift in jacketed optical silica fibers

  Kurashima, T., Horiguchi, T. & Tateda, M., 1990 5月 1, In: Appl. Opt.. 29, p. 2219-2222

  研究成果: Article › 査読

  189 被引用数 (Scopus)

• Thermal efficiency evaluation of HI synthesis/concentration procedures in the thermochemical water splitting IS process

  Kasahara, S., Kubo, S., Onuki, K. & Nomura, M., 2004 5月, In: International Journal of Hydrogen Energy. 29, 6, p. 579-587 9 p.

  研究成果: Article › 査読
  50 被引用数 (Scopus)

• Thermal Efficiency of the IS Process for Thermochemical Hydrogen Production Using the HTGR

  Kasahara, S., Hwang, G-J., Choi, H-S., Onuki, K. & Nomura, M., 2003 9月 15, In: International Conference on Global Environment and Advanced Nuclear Plants. p. 1038-1038

  研究成果: Article › 査読

• Thermal-expansion-type Microactuator for Endoscopic Surgery.

  N, K., R., T., K., T. & Kabei, N., 1997 1月 1, In: Default journal.

  研究成果: Article › 査読

• Thermal-expansion-type microactuator using paraffin as expansive material (Basic performance of a prototype linear actuator)

  Kabei, N., Kosuda, M., Kagamibuchi, H., Tashiro, R., Mizuno, H., Ueda, Y. & Tsuchiya, K., 1996, In: Nippon Kikai Gakkai Ronbunshu, C Hen/Transactions of the Japan Society of Mechanical Engineers, Part C. 62, 604, p. 4624-4629 6 p.

  研究成果: Article › 査読

  Open Access
  2 被引用数 (Scopus)

• Thermal Fatigue Damage of Quad Flat Pack Leads and Sn-3.5Ag-X(x=Bi and Cu) Solder Joints

  Warashina, K., Kariya, Y., Hirata, Y. & Otsuka, M., 1999 2月 1, In: Default journal.

  研究成果: Article › 査読

• Thermal fatigue life evaluation of epoxy resin/Si joint under mineral oil condition

  Takahashi, H. & Kariya, Y., 2016, In: Materials Transactions. 57, 6, p. 805-809 5 p.

  研究成果: Article › 査読
  1 被引用数 (Scopus)

• Thermal Fatigue Life of Eutectic Solder Bumps for Flip-chip Interconnection,

  K.Doi, K. D., N.Hirano, N. H., M.Mukai, M. M., T.Okada, T. O., Y.Hiruta, Y. H., T.Sudo, T. S. & Sudo, T., 1993 12月 5, In: The 2nd VLSI Packaging Workshop,. p. 103-104

  研究成果: Article › 査読

• Thermal Fatigue Life Prediction Model and Acceleration Factor for Sn-Ag-Cu Solder Joint

  K, Y., a, A. & Kariya, Y., 2011 12月 1, In: Proc. Of International Conference on Electronics Materials and Packaging. EMAP2011

  研究成果: Article › 査読