TY - GEN
T1 - A bonding technique for electric circuit prototyping using conductive transfer foil and soldering iron
AU - Suzuki, Tomohito
AU - Imai, Yuhei
AU - Manabe, Hiroyuki
N1 - Funding Information:
This work was supported by JSPS KAKENHI Grant Number 20K19851.
Publisher Copyright:
© 2022 Owner/Author.
PY - 2022/10/29
Y1 - 2022/10/29
N2 - Several electric circuit prototyping techniques have been proposed. While most focus on creating the conductive traces, we focus on the bonding technique needed for this kind of circuit. Our technique is an extension of existing work in that we use the traces themselves as the bonding material for the components. The bonding process is not soldering but yields joints of adequate connectivity. A hot soldering iron is used to activate the traces and bond the component to the circuit. Simple circuits are created on MDF, paper, and acrylic board to show the feasibility of the technique. It is also confirmed that the resistance of the contact points is sufficiently low.
AB - Several electric circuit prototyping techniques have been proposed. While most focus on creating the conductive traces, we focus on the bonding technique needed for this kind of circuit. Our technique is an extension of existing work in that we use the traces themselves as the bonding material for the components. The bonding process is not soldering but yields joints of adequate connectivity. A hot soldering iron is used to activate the traces and bond the component to the circuit. Simple circuits are created on MDF, paper, and acrylic board to show the feasibility of the technique. It is also confirmed that the resistance of the contact points is sufficiently low.
KW - 3D printer
KW - bonding
KW - circuit prototyping
KW - transfer foil
UR - http://www.scopus.com/inward/record.url?scp=85141387374&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85141387374&partnerID=8YFLogxK
U2 - 10.1145/3526114.3558670
DO - 10.1145/3526114.3558670
M3 - Conference contribution
AN - SCOPUS:85141387374
T3 - UIST 2022 Adjunct - Adjunct Proceedings of the 35th Annual ACM Symposium on User Interface Software and Technology
BT - UIST 2022 Adjunct - Adjunct Proceedings of the 35th Annual ACM Symposium on User Interface Software and Technology
PB - Association for Computing Machinery, Inc
T2 - 35th Annual ACM Symposium on User Interface Software and Technology, UIST 2022
Y2 - 29 October 2022 through 2 November 2022
ER -