A degradation-free Cu/HSQ damascene technology using metal mask patterning and post-CMP cleaning by electrolytic ionized water

H.Aoki H.Aoki; S.Yamazaki S.Yamazaki; T.Usami T.Usami; Y.Tsuchiya Y.Tsuchiya; N.Ito N.Ito; T.Onodera T.Onodera; Y.Hayash Y.Hayash; K.Ueno K.Ueno; H.Gomi H.Gomi; Kazuyoshi Ueno

A degradation-free Cu/HSQ damascene technology using metal mask patterning and post-CMP cleaning by electrolytic ionized water

H.Aoki H.Aoki, S.Yamazaki S.Yamazaki, T.Usami T.Usami, Y.Tsuchiya Y.Tsuchiya, N.Ito N.Ito, T.Onodera T.Onodera, Y.Hayash Y.Hayash, K.Ueno K.Ueno, H.Gomi H.Gomi, Kazuyoshi Ueno

機能制御システム専攻

研究成果: Article › 査読

2 被引用数 (Scopus)

本文言語	English
ページ（範囲）	777-780
ジャーナル	1997 IEDM Technical Digest
出版ステータス	Published - 1997 12月 1

引用スタイル

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title = "A degradation-free Cu/HSQ damascene technology using metal mask patterning and post-CMP cleaning by electrolytic ionized water",

author = "H.Aoki H.Aoki and S.Yamazaki S.Yamazaki and T.Usami T.Usami and Y.Tsuchiya Y.Tsuchiya and N.Ito N.Ito and T.Onodera T.Onodera and Y.Hayash Y.Hayash and K.Ueno K.Ueno and H.Gomi H.Gomi and Kazuyoshi Ueno",

year = "1997",

month = dec,

day = "1",

language = "English",

pages = "777--780",

journal = "1997 IEDM Technical Digest",

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TY - JOUR

T1 - A degradation-free Cu/HSQ damascene technology using metal mask patterning and post-CMP cleaning by electrolytic ionized water

AU - H.Aoki, H.Aoki

AU - S.Yamazaki, S.Yamazaki

AU - T.Usami, T.Usami

AU - Y.Tsuchiya, Y.Tsuchiya

AU - N.Ito, N.Ito

AU - T.Onodera, T.Onodera

AU - Y.Hayash, Y.Hayash

AU - K.Ueno, K.Ueno

AU - H.Gomi, H.Gomi

AU - Ueno, Kazuyoshi

PY - 1997/12/1

Y1 - 1997/12/1

M3 - Article

SP - 777

EP - 780

JO - 1997 IEDM Technical Digest

JF - 1997 IEDM Technical Digest

ER -