TY - GEN
T1 - A leakage current monitor circuit using silicon on thin BOX MOSFET for dynamic back gate bias control
AU - Okuhara, Hayate
AU - Usami, Kimiyoshi
AU - Amano, Hideharu
N1 - Publisher Copyright:
© 2015 IEEE.
PY - 2015/7/14
Y1 - 2015/7/14
N2 - A leakage current monitor circuit was developed for dynamic back gate bias control of CMOS LSI with Silicon on Thin BOX (SOTB) technology. By using the SOTB technology, sensors or wearable devices can suppress the leakage power by giving deep reverse body bias when they are not used. Once an event occurs, they must turn to the operational mode by changing the body bias quickly. According to the real chip evaluation, it takes hundreds of micro seconds, and the wake-up time is difficult to be estimated. The proposed detector using a leakage current monitor circuit guarantees that the target module is ready to be operational. The target body bias voltage for operation can be controlled by the bias voltage of the detector domain, which is computed with an expression in advance. SPICE simulation reveals that formulation is done and power overhead is only 42.7-42.9nW in the room temperature. Compensation equations for various temperatures are also shown.
AB - A leakage current monitor circuit was developed for dynamic back gate bias control of CMOS LSI with Silicon on Thin BOX (SOTB) technology. By using the SOTB technology, sensors or wearable devices can suppress the leakage power by giving deep reverse body bias when they are not used. Once an event occurs, they must turn to the operational mode by changing the body bias quickly. According to the real chip evaluation, it takes hundreds of micro seconds, and the wake-up time is difficult to be estimated. The proposed detector using a leakage current monitor circuit guarantees that the target module is ready to be operational. The target body bias voltage for operation can be controlled by the bias voltage of the detector domain, which is computed with an expression in advance. SPICE simulation reveals that formulation is done and power overhead is only 42.7-42.9nW in the room temperature. Compensation equations for various temperatures are also shown.
KW - Dynamic Back Gate Bias Scaling
KW - Leakage Monitor
KW - SOTB MOSFET
UR - http://www.scopus.com/inward/record.url?scp=84943302754&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84943302754&partnerID=8YFLogxK
U2 - 10.1109/CoolChips.2015.7158656
DO - 10.1109/CoolChips.2015.7158656
M3 - Conference contribution
AN - SCOPUS:84943302754
T3 - IEEE Symposium on Low-Power and High-Speed Chips, COOL Chips XVIII - Proceedings
BT - IEEE Symposium on Low-Power and High-Speed Chips, COOL Chips XVIII - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 18th IEEE Symposium on Low-Power and High-Speed Chips, COOL Chips 2015
Y2 - 13 April 2015 through 15 April 2015
ER -