A New Polyimide Siloxane Film for Interlayer Dielectrics in Sub-micron Multilevel Interconnection

T.Homma T.Homma; K.Eguchi K.Eguchi; Y.Numasawa Y.Numasawa; T.Kikkawa T.Kikkawa; Y.Hokari Y.Hokari; K.Hamano K.Hamano; Tetsuya Homma

A New Polyimide Siloxane Film for Interlayer Dielectrics in Sub-micron Multilevel Interconnection

T.Homma T.Homma, K.Eguchi K.Eguchi, Y.Numasawa Y.Numasawa, T.Kikkawa T.Kikkawa, Y.Hokari Y.Hokari, K.Hamano K.Hamano, Tetsuya Homma

機能制御システム専攻

研究成果: Article › 査読

7 被引用数 (Scopus)

本文言語	English
ページ（範囲）	279-285
ジャーナル	Proceedings of 5th IEEE VLSI Multilevel Interconnection Conference
出版ステータス	Published - 1988 6月 13

引用スタイル

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title = "A New Polyimide Siloxane Film for Interlayer Dielectrics in Sub-micron Multilevel Interconnection",

author = "T.Homma T.Homma and K.Eguchi K.Eguchi and Y.Numasawa Y.Numasawa and T.Kikkawa T.Kikkawa and Y.Hokari Y.Hokari and K.Hamano K.Hamano and Tetsuya Homma",

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journal = "Proceedings of 5th IEEE VLSI Multilevel Interconnection Conference",

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AU - T.Homma, T.Homma

AU - K.Eguchi, K.Eguchi

AU - Y.Numasawa, Y.Numasawa

AU - T.Kikkawa, T.Kikkawa

AU - Y.Hokari, Y.Hokari

AU - K.Hamano, K.Hamano

AU - Homma, Tetsuya

PY - 1988/6/13

Y1 - 1988/6/13

M3 - Article

SP - 279

EP - 285

JO - Proceedings of 5th IEEE VLSI Multilevel Interconnection Conference

JF - Proceedings of 5th IEEE VLSI Multilevel Interconnection Conference

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