TY - GEN
T1 - Active control of micro-droplets by hybrid magnetically driven microtool
AU - Yamanishi, Yoko
AU - Kihara, Yuki
AU - Sakuma, Shinya
AU - Arai, Fumihito
PY - 2009
Y1 - 2009
N2 - We propose a hybrid polymer-metal magnetically driven microtool (MMT) featuring elasticity and rigidity. An electroplated magnetic metal axle is installed directly at the center of the MMT during molding. The result is a hybrid MMT whose fixed axes move elastically in a specific direction and whose center axle is rigid, preventing bending by unwanted external force. The axle's higher magnetism contributes to powerful actuation. The hybrid MMT we designed provides on-demand droplet dispensation on chips. Its parallel plate is constrained translationally. Hybrid MMT displacement is 300 μm -- 6 times greater than that of the conventional MMT. On-demand droplet generation produces a 177.7 ±2.3 μm droplet
AB - We propose a hybrid polymer-metal magnetically driven microtool (MMT) featuring elasticity and rigidity. An electroplated magnetic metal axle is installed directly at the center of the MMT during molding. The result is a hybrid MMT whose fixed axes move elastically in a specific direction and whose center axle is rigid, preventing bending by unwanted external force. The axle's higher magnetism contributes to powerful actuation. The hybrid MMT we designed provides on-demand droplet dispensation on chips. Its parallel plate is constrained translationally. Hybrid MMT displacement is 300 μm -- 6 times greater than that of the conventional MMT. On-demand droplet generation produces a 177.7 ±2.3 μm droplet
KW - Droplet dispensing
KW - Magnetically driven microtool
UR - http://www.scopus.com/inward/record.url?scp=77952350777&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=77952350777&partnerID=8YFLogxK
U2 - 10.1109/SI.2009.5384564
DO - 10.1109/SI.2009.5384564
M3 - Conference contribution
AN - SCOPUS:77952350777
SN - 9781424459070
T3 - 2009 IEEE/SICE International Symposium on System Integration: SI International 2008 - The 2nd Symposium on System Integration
SP - 1
EP - 6
BT - 2009 IEEE/SICE International Symposium on System Integration
T2 - 2nd International Symposium on System Integration, SII 2009
Y2 - 29 November 2009 through 29 November 2009
ER -