TY - GEN
T1 - Anti-resonance peak shift due to variation of effective package inductance
AU - Kubo, Genki
AU - Otsuka, Hiroki
AU - Kobayashi, Ryota
AU - Ichimura, Wataru
AU - Kiyoshige, Sho
AU - Terasaki, Masahiro
AU - Sudo, Toshio
PY - 2013/12/1
Y1 - 2013/12/1
N2 - Power integrity is a serious issue in the in the modern CMOS digital systems, because power supply noise excited in core circuits induces logic instability and electromagnetic radiation. Therefore, chip-package co-design is becoming important by taking into consideration the total impedance of power distribution network (PDN) seen from the chip. Especially, parallel resonance peaks in the PDN due to the chip-package interaction induces the unwanted power supply fluctuation, and results in the degradation of signal integrity and electromagnetic interference (EMI). In this paper, peak frequency shift in the total PDN impedance in three test chips with different on-die PDN properties was observed when the package inductance was changed.
AB - Power integrity is a serious issue in the in the modern CMOS digital systems, because power supply noise excited in core circuits induces logic instability and electromagnetic radiation. Therefore, chip-package co-design is becoming important by taking into consideration the total impedance of power distribution network (PDN) seen from the chip. Especially, parallel resonance peaks in the PDN due to the chip-package interaction induces the unwanted power supply fluctuation, and results in the degradation of signal integrity and electromagnetic interference (EMI). In this paper, peak frequency shift in the total PDN impedance in three test chips with different on-die PDN properties was observed when the package inductance was changed.
KW - anti resonance peak
KW - power integrity
UR - http://www.scopus.com/inward/record.url?scp=84894128395&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84894128395&partnerID=8YFLogxK
U2 - 10.1109/EDAPS.2013.6724431
DO - 10.1109/EDAPS.2013.6724431
M3 - Conference contribution
AN - SCOPUS:84894128395
SN - 9781479923113
T3 - EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium
SP - 229
EP - 232
BT - EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium
T2 - 2013 6th IEEE Electrical Design of Advanced Packaging Systems Symposium, EDAPS 2013
Y2 - 12 December 2013 through 15 December 2013
ER -