TY - GEN
T1 - Application of novel ultrasonic cleaning equipment using waveguide mode for single-wafer cleaning process
AU - Suzuki, Kazunari
AU - Imazeki, Yasuhiro
AU - Han, Ki
AU - Okano, Shoichi
AU - Soejima, Junichiro
AU - Koike, Yoshikazu
PY - 2010/12/1
Y1 - 2010/12/1
N2 - The influence of pattern defect on semiconductor devices by ultrasonic cavitation has been reported. The authors demonstrated single-wafer cleaning using the weveguide-type ultrasonic equipment. The cavitation bubble collapse can be suppressed and the sufficient particle removal efficiency (PRE) can be obtained in the comparison with the conventional batch-wafer ultrasonic equipment. Generation of the cavitation bubble collapse was observed using photo-resist film coated on wafer.
AB - The influence of pattern defect on semiconductor devices by ultrasonic cavitation has been reported. The authors demonstrated single-wafer cleaning using the weveguide-type ultrasonic equipment. The cavitation bubble collapse can be suppressed and the sufficient particle removal efficiency (PRE) can be obtained in the comparison with the conventional batch-wafer ultrasonic equipment. Generation of the cavitation bubble collapse was observed using photo-resist film coated on wafer.
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M3 - Conference contribution
AN - SCOPUS:79957663621
SN - 9781617822810
T3 - Advanced Metallization Conference (AMC)
SP - 298
EP - 299
BT - Advanced Metallization Conference 2010
T2 - Advanced Metallization Conference 2010
Y2 - 5 October 2010 through 7 October 2010
ER -