Building block multi-chip systems using inductive coupling through chip interface

Hideharu Amano; Tadahiro Kuroda; Hiroshi Nakamura; Kimiyoshi Usami; Masaaki Kondo; Hiroki Matsutani; Mitaro Namiki

doi:10.1109/ISOCC.2017.8368842

Building block multi-chip systems using inductive coupling through chip interface

Hideharu Amano, Tadahiro Kuroda, Hiroshi Nakamura, Kimiyoshi Usami, Masaaki Kondo, Hiroki Matsutani, Mitaro Namiki

研究成果: Conference contribution

抄録

A building block computing system is consisting of multiple chips connecting with inductive coupling wireless through chip interconnect. Like building Lego blocks, various types of systems can be built by stacking different types of chips. In order to develop such systems, several techniques are investigated in the project: that is, inductive coupling wireless through chip interface, low power circuit technologies, autonomous interconnection network architectures, thermal dissipation and building block operating system. Here, the overview of the project and a prototype system are introduced.

本文言語	English
ホスト出版物のタイトル	Proceedings - International SoC Design Conference 2017, ISOCC 2017
出版社	Institute of Electrical and Electronics Engineers Inc.
ページ	152-154
ページ数	3
ISBN（電子版）	9781538622858
DOI	https://doi.org/10.1109/ISOCC.2017.8368842
出版ステータス	Published - 2018 5月 29
イベント	14th International SoC Design Conference, ISOCC 2017 - Seoul, Korea, Republic of 継続期間: 2017 11月 5 → 2017 11月 8

出版物シリーズ

名前	Proceedings - International SoC Design Conference 2017, ISOCC 2017

Other

Other	14th International SoC Design Conference, ISOCC 2017
国/地域	Korea, Republic of
City	Seoul
Period	17/11/5 → 17/11/8

ASJC Scopus subject areas

ハードウェアとアーキテクチャ
電子工学および電気工学
電子材料、光学材料、および磁性材料

文献へのアクセス

10.1109/ISOCC.2017.8368842

他のファイルとリンク

引用スタイル

Amano, H., Kuroda, T., Nakamura, H., Usami, K., Kondo, M., Matsutani, H., & Namiki, M. (2018). Building block multi-chip systems using inductive coupling through chip interface. In Proceedings - International SoC Design Conference 2017, ISOCC 2017 (pp. 152-154). (Proceedings - International SoC Design Conference 2017, ISOCC 2017). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISOCC.2017.8368842

Building block multi-chip systems using inductive coupling through chip interface. / Amano, Hideharu; Kuroda, Tadahiro; Nakamura, Hiroshi その他.
Proceedings - International SoC Design Conference 2017, ISOCC 2017. Institute of Electrical and Electronics Engineers Inc., 2018. p. 152-154 (Proceedings - International SoC Design Conference 2017, ISOCC 2017).

研究成果: Conference contribution

Amano, H, Kuroda, T, Nakamura, H, Usami, K, Kondo, M, Matsutani, H & Namiki, M 2018, Building block multi-chip systems using inductive coupling through chip interface. in Proceedings - International SoC Design Conference 2017, ISOCC 2017. Proceedings - International SoC Design Conference 2017, ISOCC 2017, Institute of Electrical and Electronics Engineers Inc., pp. 152-154, 14th International SoC Design Conference, ISOCC 2017, Seoul, Korea, Republic of, 17/11/5. https://doi.org/10.1109/ISOCC.2017.8368842

Amano H, Kuroda T, Nakamura H, Usami K, Kondo M, Matsutani H その他. Building block multi-chip systems using inductive coupling through chip interface. In Proceedings - International SoC Design Conference 2017, ISOCC 2017. Institute of Electrical and Electronics Engineers Inc. 2018. p. 152-154. (Proceedings - International SoC Design Conference 2017, ISOCC 2017). doi: 10.1109/ISOCC.2017.8368842

@inproceedings{d0357c6c1dc647d4b07d4ebf3911a477,

title = "Building block multi-chip systems using inductive coupling through chip interface",

abstract = "A building block computing system is consisting of multiple chips connecting with inductive coupling wireless through chip interconnect. Like building Lego blocks, various types of systems can be built by stacking different types of chips. In order to develop such systems, several techniques are investigated in the project: that is, inductive coupling wireless through chip interface, low power circuit technologies, autonomous interconnection network architectures, thermal dissipation and building block operating system. Here, the overview of the project and a prototype system are introduced.",

keywords = "Building block computing systems, System-in-a Package, Wireless inductive coupling",

author = "Hideharu Amano and Tadahiro Kuroda and Hiroshi Nakamura and Kimiyoshi Usami and Masaaki Kondo and Hiroki Matsutani and Mitaro Namiki",

year = "2018",

month = may,

day = "29",

doi = "10.1109/ISOCC.2017.8368842",

language = "English",

series = "Proceedings - International SoC Design Conference 2017, ISOCC 2017",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "152--154",

booktitle = "Proceedings - International SoC Design Conference 2017, ISOCC 2017",

note = "14th International SoC Design Conference, ISOCC 2017 ; Conference date: 05-11-2017 Through 08-11-2017",

}

TY - GEN

T1 - Building block multi-chip systems using inductive coupling through chip interface

AU - Amano, Hideharu

AU - Kuroda, Tadahiro

AU - Nakamura, Hiroshi

AU - Usami, Kimiyoshi

AU - Kondo, Masaaki

AU - Matsutani, Hiroki

AU - Namiki, Mitaro

PY - 2018/5/29

Y1 - 2018/5/29

N2 - A building block computing system is consisting of multiple chips connecting with inductive coupling wireless through chip interconnect. Like building Lego blocks, various types of systems can be built by stacking different types of chips. In order to develop such systems, several techniques are investigated in the project: that is, inductive coupling wireless through chip interface, low power circuit technologies, autonomous interconnection network architectures, thermal dissipation and building block operating system. Here, the overview of the project and a prototype system are introduced.

AB - A building block computing system is consisting of multiple chips connecting with inductive coupling wireless through chip interconnect. Like building Lego blocks, various types of systems can be built by stacking different types of chips. In order to develop such systems, several techniques are investigated in the project: that is, inductive coupling wireless through chip interface, low power circuit technologies, autonomous interconnection network architectures, thermal dissipation and building block operating system. Here, the overview of the project and a prototype system are introduced.

KW - Building block computing systems

KW - System-in-a Package

KW - Wireless inductive coupling

UR - http://www.scopus.com/inward/record.url?scp=85048873655&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85048873655&partnerID=8YFLogxK

U2 - 10.1109/ISOCC.2017.8368842

DO - 10.1109/ISOCC.2017.8368842

M3 - Conference contribution

AN - SCOPUS:85048873655

T3 - Proceedings - International SoC Design Conference 2017, ISOCC 2017

SP - 152

EP - 154

BT - Proceedings - International SoC Design Conference 2017, ISOCC 2017

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 14th International SoC Design Conference, ISOCC 2017

Y2 - 5 November 2017 through 8 November 2017

ER -

Building block multi-chip systems using inductive coupling through chip interface

抄録

出版物シリーズ

Other

ASJC Scopus subject areas

文献へのアクセス

他のファイルとリンク

フィンガープリント

引用スタイル